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Moscone Center
As we stand in front of a new era in technology driven by AI, the design of photonic integrated circuits (PICs) faces increasingly complex challenges. These challenges span multi-physics modeling, architecture layout, EIC-PIC co-design and design for testability. The vision of seamless integration between photonics and electronics has sparked debate regarding the sustainability of existing Electronic Design Automation (EDA) tools, which were originally developed for microelectronics with vastly different requirements and attributes. Given the stark differences in circuit complexity, manufacturing processes, and ecosystem requirements, re-evaluating these tools and improving their accessibility is both timely and necessary.
This panel aims to bring together experts in EDA toolsets for photonics for an in-depth discussion on the future of PIC design methodologies and their accessibility. By exploring various pathways, we seek to develop next-generation capabilities that meet the unique demands of photonics design of high-density circuits for key applications such as sensing, signal processing, and computing.
Organizers
Molly Piels (Lead), OpenLight Photonics, United States
Odile Liboiron-Ladouceur, McGill Univ., Canada
Wei Shi, Université Laval, Canada
Speakers
Lukas Chrostowski, Dream/UBC, Canada
Pieter Dumon, IPKISS, Belgium
Tyler Hughes, Tidy3D, United States
Gilles Lamant, Cadence, United States
Joaquin Matres Abril, Google X/GDS Factory, United States
James Pond, Ansys, Canada