• Technical Conference:  24 – 28 March 2024
  • Exhibition: 26 – 28 March 2024
  • San Diego Convention Center, San Diego, California, USA

Advanced Packaging Technologies for Optical Modules

Wednesday, 08 March, 08:00 – 10:00

Room 6C

As the baud rate, channel density, power and cost efficiency continue to scale up in optical modules, more advanced packaging technologies are being introduced to optical modules. Such packaging technologies include electronic and photonic ICs integration schemes, laser packaging/integration techniques, optical fibers or other optical connections, etc. packaging schemes that are developed at wafer foundries, outsourced semiconductor assembly and test (OSAT) companies, and component and module suppliers. This panel aims to highlight various technologies and stimulate discussions on how advanced packaging can help/shape the future optical module development.


Molly Piels, Juniper Networks, USA

Juthika Basak, Nokia, USA

Omer Khayam, Google, USA

Joris Van Campenhout, IMEC, Belgium


David Gomez, X-Celeprint Inc., Ireland

Alexander Janta-Polczynski, IBM-Bromont, Canada

John Martinho, Ranovus, Canada

Edward Preisler, Tower Semiconductor, USA

Sandeep Razdan, Cisco, USA

Sebastian Skacel, Vanguard Automation, Germany

Hasham Taha, Teramount, Israel