• A Hybrid Conference – In-Person and Virtual Presentations
  • Technical Conference:  05 – 09 March 2023
  • Exhibition: 07 – 09 March 2023
  • San Diego Convention Center, San Diego, California, USA

Advanced Packaging Technologies for Optical Modules


Omer Khayam, Google, USA
Joris Van Campenhout, IMEC, Belgium
Juthika Basak, Nokia, USA
Molly Piels, Juniper Networks, USA


As the baud rate, channel density, power and cost efficiency continue to scale up in optical modules, more advanced packaging technologies are being introduced to optical modules. Such packaging technologies include electronic and photonic ICs integration schemes, laser packaging/integration techniques, optical fibers or other optical connections, etc. packaging schemes that are developed at wafer foundries, outsourced semiconductor assembly and test (OSAT) companies, and component and module suppliers. This panel aims to highlight various technologies and stimulate discussions on how advanced packaging can help/shape the future optical module development.




David Gomez, X-Celeprint, Ireland

Thorsten Mayer, Vanguard Automation, Germany

Edward Preisler, Tower Semiconductor, USA

Sandeep Razdan, Cisco, USA

Hasham Taha, Teramount, Israel