Wednesday, 08 March,
08:00
–
10:00
Room 6C
Description:
As the baud rate, channel density, power and cost efficiency continue to scale up in optical modules, more advanced packaging technologies are being introduced to optical modules. Such packaging technologies include electronic and photonic ICs integration schemes, laser packaging/integration techniques, optical fibers or other optical connections, etc. packaging schemes that are developed at wafer foundries, outsourced semiconductor assembly and test (OSAT) companies, and component and module suppliers. This panel aims to highlight various technologies and stimulate discussions on how advanced packaging can help/shape the future optical module development.
Organizers
Molly Piels, Juniper Networks, USA
Juthika Basak, Nokia, USA
Omer Khayam, Google, USA
Joris Van Campenhout, IMEC, Belgium
Speakers
David Gomez, X-Celeprint Inc., Ireland
Alexander Janta-Polczynski, IBM-Bromont, Canada
John Martinho, Ranovus, Canada
Edward Preisler, Tower Semiconductor, USA
Sandeep Razdan, Cisco, USA
Sebastian Skacel, Vanguard Automation, Germany
Hasham Taha, Teramount, Israel