Express Data Center Interconnection Using a Photonic Cross Connect (M2C.1)
10:30 AM - 10:45 AM
We present measurements of express optical interconnection between data centers using a MEMs photonic cross connect and a packet-optical transport network under the control of a programmable netOS for dynamic traffic steering and resiliency.
Authors: J.E. Simsarian, Y. Kim, D.T. Neilson, F. Pardo, N. Basavanhally, R. Farah, R. Papazian, M. Earnshaw, E. Sutter, S. Xu, M. Thottan, Nokia Bell Labs, Holmdel, New Jersey, UNITED STATES|Y. Kim, Perspecta Labs, Basking Ridge, New Jersey, UNITED STATES|S. Xu, Rutgers, The State University of New Jersey, Piscataway, New Jersey, UNITED STATES
Performance Assessment of a Novel Rack-scale Disaggregated Data Center with Fast Optical Switch (M2C.2)
10:45 AM - 11:00 AM
We investigate a novel disaggregated architecture based on nanoseconds optical switches. Results show that under data-traffic from real applications the disaggregated architecture with 0.2 local memory rate and 40Gb/s optical links outperforms the server-centric architecture.
Authors: X. Guo, F. Yan, X. Xue, G. Exarchakos, N. Calabretta, Eindhoven University of Technology, Eindhoven, NETHERLANDS
A Practical Approach to Optical Switching in Data Centers (M2C.3)
11:00 AM - 11:30 AM Invited
Optical switching can address the energy and bandwidth scaling challenges facing data center networks, but its adoption is impeded by the cost and complexity of associated hardware and control mechanisms. This paper discusses an approach that reduces cost and complexity by co-designing the hardware and overall network architecture.
Authors: W. Mellette, University of California San Diego, San Diego, California, UNITED STATES|W. Mellette, inFocus Networks, San Diego, California, UNITED STATES
Enabling Technologies for Optical Data Center Networks: Spatial Division Multiplexing (M2C.4)
11:30 AM - 12:30 PM Tutorial
Spatial-division multiplexing (SDM) offers scaling up the transmission capacity, while reducing the number of fibers and patch cords, which simplifies cabling complexity. This tutorial will address challenges and recent developments of SDM techniques for optical datacenters.
Authors: L. Wosinska, R. Lin, J. Chen, KTH Royal Institute of Technology , Kista, Stockholm, SWEDEN|L. Wosinska, E. Agrell, Chalmers University of Technology, Gothenburg, SWEDEN
Ultra High-Speed Quantum-Well Semiconductor Lasers (M2F.1)
10:30 AM - 11:30 AM Tutorial
Evolution of ultra high-speed quantum-well semiconductor lasers with breakthrough technology for data-center and 5G-wireless are fully reviewed from pioneer research up to 100GbE/400GbE application, including challenge and advanced approaches for 800GbE and beyond.
Authors: K. Uomi, Lumentum, Kanagawa, JAPAN
Ultra-High Bandwidth InP IQ Modulator for beyond 100-GBd Transmission (M2F.2)
11:30 AM - 12:00 PM Invited
We present an ultra-high bandwidth IQ modulator with an electro-optic bandwidth of around 80 GHz at a half-wave voltage of 1.5 V, which is a promising modulator for beyond 100-GBd transmission.
Authors: Y. Ogiso, J. Ozaki, Y. Ueda, S. Kanazawa, Y. Hashizume, H. Tanobe, N. Nunoya, M. Ishikawa, NTT Device Innovation Center, Atsugi, KANAGAWA, JAPAN|H. Wakita, M. Nagatani, H. Yamazaki, T. Fujii, M. Ida, NTT Device Technology Laboratories, Atsugi, KANAGAWA, JAPAN|M. Nakamura, T. Kobayashi, Y. Miyamoto, NTT Network Innovation Laboratories, Yokosuka, KANAGAWA, JAPAN
Dual-drive Plasmonic Transmitter with Co-designed Driver Electronics Operated at 120 GBd On-off Keying (M2F.3)
12:00 PM - 12:15 PM
A plasmonic dual-drive transmitter with co-designed driver electronics featuring 120 GBd on-off keying, with a single ended drive voltage of 450mV and BER performance of 5x10^-7 is demonstrated in a 500m direct detection transmission scheme.
Authors: B. Baeuerle, W. Heni, Y. Fedoryshyn, C. Hoessbacher, U. Koch, A. Josten, T. Watanabe, J. Leuthold, ETH Zurich, Zurich, SWITZERLAND|C. Uhl, M. Möller, Chair of Electronics and Circuits, Saarland University, Saarbrücken, GERMANY|H. Hettrich, M. Möller, MICRAM Microelectronics GmbH, Bochum, GERMANY|D. Elder, L. Dalton, Department of Chemistry, University of Washington, Seattle, Washington, UNITED STATES
Optical PAM4 Signaling and System Performance for DCI Applications (M3A.1)
2:00 PM - 2:30 PM Invited
Three different PAM4-based transmission systems are demonstrated for enhancing the receiver sensitivity, increasing the capacity, and extending the reach over SMF/MMF. The measured BERs are presented as a function of OMA for system performance comparison.
Authors: R. Motaghian, Amazon, Mountain View, California, UNITED STATES
Using a Hybrid Si/III-V Semiconductor Laser to Carry 16- and 64-QAM Data Signals over an 80-km Distance (M3A.2)
2:30 PM - 2:45 PM
We have demonstrated the use of a hybrid Si/III-V semiconductor laser to carry 20-Gbaud 16- and 64-QAM data signals over an 80-km fiber. The high coherence of the laser enables below FEC threshold performance after transmission.
Authors: K. Zou, P. liao, Y. Cao, A. Almaiman, A. Fallahpour, A.E. Willner, University of Southern California, Los Angeles, California, UNITED STATES|Z. Zhang, H. Wang, A. Yariv, Department of Applied Physics and Materials Science, California Institute of Technology, Pasadena, California, UNITED STATES|N. Satyan, G. Rakuljic, Telaris Inc., Santa Monica, California, UNITED STATES|M. Tur, School of Electrical Engineering, Tel Aviv University, Ramat Aviv, California, ISRAEL|A. Yariv, Department of Electrical Engineering, California Institute of Technology, Pasadena, California, UNITED STATES
50-Gbps Receiver Subsystem using Ge/Si Avalanche Photodiode and Integrated Bypass Capacitor (M3A.3)
2:45 PM - 3:00 PM
A 50-Gbps receiver subsystem consisting of a Ge/Si avalanche photodiode and integrated metal-insulator-metal capacitor is presented which demonstrates 32 GHz receiver bandwidth, -16 dBm OMA sensitivity at BER of 2E-4, and 8 dBm optical overload.
Authors: S. Park, Y. Malinge, O. dosunmu, G. Lovell, S. slavin, K. magruder, A. Liu, Intel corporation, Santa Clara, California, UNITED STATES|Y. kang, Consultant, San Jose, California, UNITED STATES
Tb/s-Class Optical Engines Utilizing InP Coherent Receiver and Transceiver Photonic Integrated Circuits (M3A.4)
3:00 PM - 3:30 PM Invited
We report on the development of state of the art optical engines based upon multi-channel C&L Band tunable InP PICs operating up to 1 Tb/s per wave and with aggregate PIC capacities of 4.9 Tb/s
Authors: G. Hoefler, R. Going, S. Wolf, C. Berry, P. Studenkov, M. Lu, V. Lal, P. Evans, H. Tsai, S. Corzine, J. Zhang, B. Behnia, J. Tang, T. Vallaitis, J. Osenbach, M. Kuntz, A. Hosseini, T. Frost, L. Chuang, M. Montazeri, H. Mousavi, S. Porto, S. Buggaveeti, X. Xu, J. Rahn, T. Butrie, A. Karanicolas, M. Ziari, D. Welch, F.A. Kish, Infinera Corporation, Sunnyvale, California, UNITED STATES
Monolithically-Integrated 50Gbps 2pJ/bit Photoreceiver with Cherry-Hooper TIA in 250nm BiCMOS Technology (M3A.5)
3:30 PM - 3:45 PM
We report a monolithically-integrated photoreceiver with a pseudo-differential Cherry-Hooper transimpedance amplifier (TIA) in a 250 nm BiCMOS process. High sensitivity 50 Gbps operation in demonstrated, and the TIA architecture is analyzed.
Authors: H. Andrade, T. Hirokawa, A. Maharry, C. Schow, J.F. Buckwalter, University of California Santa Barbara, Goleta, California, UNITED STATES|A. Rylyakov, Elenion Technologies, New York, New York, UNITED STATES
APSUNY Process Design Kit (PDKv3.0): O, C and L Band Silicon Photonics Component Libraries on 300mm Wafers (Tu2A.1)
2:00 PM - 2:15 PM
An updated process design kit (APSUNY PDKv3.0) is introduced with verified passive and active O+C+L band silicon photonics component libraries, which includes 50Gbaud (100Gbps) capable modulators, high yield splitters and detectors on 300mm SOI wafers.
Authors: E. Timurdogan, Z. Su, R. Shiue, C.V. Poulton, M.J. Byrd, S. Xin, M.R. Watts, Analog Photonics, Boston, Massachusetts, UNITED STATES
An all-silicon transmitter with co-designed modulator and DC-coupled driver (Tu2A.2)
2:15 PM - 2:30 PM
We present a co-designed silicon traveling wave modulator with a SiGe driver with 6Vpp effective swing. 34GBaud DP-16QAM is demonstrated with comparable ROSNR performance to a commercial CFP2-ACO.
Authors: Y. Ma, C. Williams, M. Ahmed, A. Elmoznine, D. Lim, Y. Liu, R. Shi, T. Huynh, J. Roman, A. Ahmed, L. Vera, Y. Chen, A. Horth, H. Guan, K. Padmaraju, M. Streshinsky, A. Novack, R. Sukkar, R. Younce, A. Rylyakov, D. Scordo, M. Hochberg, Elenion Technologies, New York, New York, UNITED STATES
Reliable Heterogeneous and Monolithic Integrated Silicon Photonics (Tu2A.3)
2:30 PM - 3:00 PM Invited
We will present reliability and performance data from Intel silicon photonics lasers, based on heterogeneous bonding of InP on silicon, and also reliability of quantum dot lasers grown on silicon substrates in collaboration with UCSB.
Authors: R. Herrick, C. Jan, N. Caranto, Reliability Dept., Intel Corporation, Santa Clara, California, UNITED STATES|D. Jung, J. Norman, J. Selvidge, K. Mukherjee, Dept. of Material Science, University of California, Santa Barbara, California, UNITED STATES|J.E. Bowers, Dept. of ECE, University of California, Santa Barbara, California, UNITED STATES
80-km Transmission with Silicon Micro-Ring Modulators and Kramers-Kronig Direct Detection (Tu2A.4)
3:00 PM - 3:15 PM
Single sideband signals generated by micro-ring modulators were demonstrated for 80-km standard single-mode fiber transmission with Kramers-Kronig direct detection. The integrated transmitter with KK receiver is suitable for future low-cost, low-power and low-footprint datacenter interconnects.
Authors: Y. Tong, Q. Zhang, X. Wu, C. Shu, H. Tsang, Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, HONG KONG
64-GBd DP-bipolar-8ASK Transmission over 120 km SSMF Employing a Monolithically Integrated Driver and MZM in 0.25-µm SiGe BiCMOS Technology (Tu2A.5)
3:15 PM - 3:30 PM
We demonstrate 64-GBd signal generation up to bipolar-8-ASK utilizing a single MZM, monolithically integrated with segmented drivers in SiGe. Using polarization multiplexing, 300-Gb/s net data rate transmission over 120 km SSMF is shown.
Authors: G. Raoof Mehrpoor, B. Wohlfeil, D. Rafique, A. Dochhan, M. Eiselt, J. Elbers, Advanced Technology, ADVA Optical Networking SE, Meiningen, GERMANY|C. Schmidt-Langhorst, R. Elschner, R. Emmerich, C. Schubert, Fraunhofer Heinrich Hertz Institute, Berlin, Brandenburg, GERMANY|I. Garcia Lopez, P. Rito, D. Petousi, D. Kissinger, L. Zimmermann, IHP GmbH, Frankfurt (Oder), Brandenburg, GERMANY|G. Raoof Mehrpoor, B. Schmauss, LHFT, Friedrich-Alexander University of Erlangen-Nuremberg, Erlangen, Brandenburg, GERMANY
A Single-mode Expanded Beam Separable Fiber Optic Interconnect for Silicon Photonics (Tu2A.6)
3:30 PM - 3:45 PM
An expanded beam optical interconnect is introduced that provides a separable connection between photonic integrated circuit and single-mode fiber. Insertion loss data are provided and stability through solder reflow is demonstrated.
Authors: D. Schoellner, M. Hughes, D. Childers, D. Kurtz, K. Wang, S. Sengupta, US Conec Ltd, Hickory, North Carolina, UNITED STATES
Multi-core Fiber Socket-assisted Packaging for 84-channel Ultra-dense Silicon Photonics IO (Tu2A.7)
3:45 PM - 4:00 PM
A femtosecond-laser 3D structured silica chip with alignment sockets has permitted precise and compact packaging of multi-core fiber for edge coupling to silicon photonic chips, with average single-pass loss of ~5.6 dB over 84 channels.
Authors: G. Djogo, S. Ho, H. Moez, E. Ertorer, J. Li, P.R. Herman, University of Toronto, Thornhill, Ontario, CANADA|J. Liu, X. Song, J. Suo, Huawei Technologies Co., Ltd., Dongguan, Ontario, CHINA
Realities and Challenges of III-V/Si Integration Technologies (Tu3E.1)
4:30 PM - 5:00 PM Invited
The complexity of photonic integrated circuits has progressed rapidly, but serious problems remain to be solved to enable widespread application in Tbps transceivers and optical scanners. A summary of progress, problems and potential solutions is provided.
Authors: J.E. Bowers, D. Huang, D. Jung, J. Norman, M. Tran, Y. wan, W. xie, University of California Santa Barbara, Santa Barbara, California, UNITED STATES
Fully Integrated Stokes Vector Receiver for 400 Gbit/s (Tu3E.2)
5:00 PM - 5:15 PM
We propose and demonstrate a new photonic integrated circuit (PIC) design for Stokes vector reception. Its accuracy is 2.5° across the entire Poincaré sphere and almost than the entire C-band.
Authors: M. Baier, F. Soares, A. Schoenau, Y. Gupta, D. Melzer, M. Schell, Fraunhofer HHI, Berlin, GERMANY
Demonstration of Ge/Si Avalanche Photodetector Arrays for Lidar Application (Tu3E.3)
5:15 PM - 5:30 PM
We report Ge-on-Si APD arrays with up to 10-by-10 pixels at 1550nm. Our demonstration reveals highly uniform responsivity of ~3.3 A/W with <7% variation. The bandwidth is 9GHz and 0.7GHz for single and 10×10 array.
Authors: Y. Li, X. Luo, G. Liang, G. Lo, Advanced Micro foundry Pte. Ltd., Singapore, SINGAPORE|Y. Li, Institute of Microelectronics, ASTAR, Singapore, SINGAPORE
Computationally-optimized Ultra-Compact Nanophotonics (Tu3E.4)
5:30 PM - 6:00 PM Invited
Computational techniques, such as nonlinear optimization, when guided by manufacturing constraints, can result in highly practical, robust, CMOS-compatible, ultra-compact (on the order of the wavelength) and multi-functional integrated- photonics components.
Authors: R. Menon, University of Utah, Del Mar, California, UNITED STATES
Large-Scale Monolithic Optical Phased Arrays (Tu3E.5)
6:00 PM - 6:30 PM Invited
This paper covers architectures, devices, recent advancements, and selected remaining challenges towards large-scale monolithic optical phased arrays with emphasis on silicon process.
Authors: H. Hashemi, University of Southern California, Los Angeles, California, UNITED STATES
Energy Consumption Modelling of Coherent Transmission in Data Centers (W1F.1)
8:00 AM - 8:30 AM Invited
We analyze energy consumption of coherent transmitters and receivers for intra- and inter-data center links and model trends in energy consumption of global-scale data center networks as the volume of traffic increases.
Authors: R.S. Tucker, University of Melbourne, Parkville, Victoria, AUSTRALIA
Comparison of Coherent and IMDD Transceivers for Intra Datacenter Optical Interconnects (W1F.2)
8:30 AM - 8:45 AM
We experimentally evaluated the performance of 400G coherent and IMDD transceivers for intra-datacenter interconnects, and showed that coherent transceivers can achieve a higher power budget with comparable ASIC power consumption.
Authors: J. Cheng, Alibaba Group, Hangzhou, CHINA|Y. Chen, X. Chen, M. Tang, S. Fu, Huazhong University of Sci. & Tech., Wuhan, CHINA|C. Xie, Alibaba Group, Sunnyvale, California, UNITED STATES
Achievable Rate Comparison between Entropy and Bit Loading in a 100-Gb/s DM-DD DMT System (W1F.3)
8:45 AM - 9:00 AM
We propose an efficient entropy loading (EL) scheme with NGMI target based on look-up tables. We reveal the EL superiority on channel coding over bit loading in a 100-Gb/s DM-DD DMT system, proving EL as the best capacity-approaching modulation for band-limited transceiver.
Authors: D. Che, Nokia Bell Labs, Holmdel, New Jersey, UNITED STATES|D. Che, W. Shieh, The University of Melbourne, Melbourne, Victoria, AUSTRALIA
Direct-Detection Technologies for Intra- and Inter-Data Center Optical Links (W1F.4)
9:00 AM - 10:00 AM Tutorial
We present the evolution of fiber-optic communication systems, review the phenomena limiting the bitrate and reach of intensity modulation–direct detection-based systems, overview proposals for DSP-enabled direct detection, and conclude with coherent-lite for short reaches.
Authors: M. Chagnon, Transmission and DSP, Nokia Bell Labs, Stuttgart, Baden-Wurttemberg, GERMANY
Slotted Optical Datacenter Network with Sub-Wavelength Resource Allocation (W1J.1)
8:00 AM - 8:30 AM Invited
We describe the dynamic resource allocation problem in a slotted Datacenter network and present fast scheduling solutions to solve it. We then review scalability related issues.
Authors: K. Kontodimas, E. Varvarigos, National Technical University of Athens, Athens, GREECE|K. Christodoulopoulos, L. Dembeck, Nokia Bell Labs, Stuttgart, GERMANY
Novel Lambda-Rich Torus DC Network: From Underlying Principles to Candidate Technologies (W1J.2)
8:30 AM - 9:00 AM Invited
We review the principles and technologies required for realizing a dynamic optical DC network comprising a few thousands of nodes based on new exploitation of λ resources and burst-mode transmission to enable scheduling-free optical flows/packets without collision
Authors: S.A. Ibrahim, T. Hashimoto, NTT Device Technology Laboratories, Atsugi-shi, KANAGAWA, JAPAN
OPTUNS: Optical Edge Datacenter Network Architecture and Prototype Testbed for Supporting 5G (W1J.3)
9:00 AM - 9:30 AM Invited
We present the architecture/testbed of an SDN-based optical-tunnel-network system (OPTUNS) for 5G edge-datacenters. Benchmarking results show that, compared to electrical-spine-leaf datacenter-network, OPTUNS achieves 82.6% power saving and significantly lower mean/p99 latency under high traffic load/locality.
Authors: M.C. Yuang, P. Tien, W. Ruan, C. Chen, Y. Luo, M. Tsai, National Chiao Tung University, Hsinchu, TAIWAN|T. Lin, S. Wen, P. Tseng, C. Lin, Delta Electronics, Taipei, TAIWAN|C. Chen, CYNTEC, Hsinchu, TAIWAN|S. Zhong, Bandwidth Express LLC, Baltimore, Maryland, UNITED STATES
Achieving Ultralow-Latency Optical Interconnection for High Performance Computing (HPC) Systems by Joint Allocation of Computation and Communication Resources (W1J.4)
9:30 AM - 9:45 AM
We propose joint allocation of computation resource and optical transmission time slices to realize ultralow-latency optical interconnection in time-synchronized HPC systems. Results show that over 80% reduction in buffering time is achieved at high load.
Authors: R. Luo, Y. Yu, N. Hua, Z. Zhong, J. Li, X. Zheng, B. Zhou, Tsinghua University, Beijing, BEIJING, CHINA
Flat, Highly Connected Optical Network for Data Centers (W1J.5)
9:45 AM - 10:00 AM
A novel flat optical DC network approach using only low radix electrical switches and high data rate optical links is investigated. Compared to Clos, it provides resilience and ~40% hardware savings with ~60% higher throughput.
Authors: M.Y. Frankel, V. Pelekhaty, J.P. Mateosky, Ciena Corporation, Hanover, Maryland, UNITED STATES
High Bandwidth Silicon Photonics Systems (W3E.1)
2:00 PM - 3:00 PM Tutorial
High Bandwidth Silicon Photonics Systems
Authors: C. Koos, Karlsruhe Institute of Technology KIT, Karlsruhe, GERMANY
A 4×40 Gb/s O-band WDM Silicon Photonic Transmitter based on Micro-Ring Modulators (W3E.2)
3:00 PM - 3:15 PM
We present an O-band micro-ring-based silicon-photonic 4-channel WDM transmitter with 6.75 nm-channel spacing for high-speed optical interconnects and demonstrate 4×40 Gb/s data generation operation featuring an energy efficiency of 24.84 fJ/bit/RM under 1.82 Vpp drive.
Authors: S. Pitris, M. Moralis-Pegios, T. Alexoudi, N. Pleros, Department of Informatics, Aristotle University of Thessaloniki, Thessaloniki, GREECE|S. Pitris, M. Moralis-Pegios, T. Alexoudi, N. Pleros, Center for Interdisciplinary Research & Innovation, Aristotle University of Thessaloniki, The, GREECE|Y. Ban, P. De Heyn, J. Van Campenhout, imec, Leuven, BELGIUM
A Compact 100G-ER4 ROSA Realized by Hybrid Integration of SOA and Lensed PIN-PDs for QSFP28 Transceivers (W3E.3)
3:15 PM - 3:30 PM
With hybrid integration of SOA and lensed PIN-PD chips on a silica-based AWG platform, we have developed a novel compact 100G-ER4 ROSA for QSFP28 transceivers with sensitivities below -27 dBm at a BER of 1×10-12.
Authors: Y. Han, D. Lee, J. Shin, S. park, S. Kim, Y. Baek, Electronics & Telecomm Res. Inst, Daejeon, KOREA (THE REPUBLIC OF)|S. Shin, H. Kim, B. Yoon, ARTECH, Seoul, KOREA (THE REPUBLIC OF)
100Gbps CWDM4 Silicon Photonics Transmitter for 5G Applications (W3E.4)
3:30 PM - 3:45 PM
A 100Gbps CWDM4 silicon photonics transmitter with four heterogeneously integrated distributed feedback lasers on 20 nm wavelength grids has been demonstrated for 5G wireless front-haul applications over a temperature range of -20°C to 95°C
Authors: H. yu, J. Doylend, W. lin, K. Nguyen, W. Liu, D. Gold, A. Dahal, C. Jan, R. Herrick, G. Ghiurcan, S. Hollingsworth, R. Romero, M. Favaro, L. Qiu, D. Zhu, Y. Akulova, Intel, Santa Clara, California, UNITED STATES
A Directly Modulated Quantum Dot Microring Laser Transmitter with Integrated CMOS Driver (W3E.5)
3:45 PM - 4:00 PM
We demonstrate an integrated heterogeneous quantum-dot laser transmitter directly modulated by a CMOS driver. Utilizing a developed co-simulation laser model enables the design of an asymmetric 2-tap equalizer to achieve a record 12 Gb/s operation.
Authors: Y. Fan, A. Roshan-Zamir, S. Palermo, Texas A&M University, COLLEGE STATION, Texas, UNITED STATES|D. Liang, C. Zhang, B. Wang, M. Fiorentino, R. Beausoleil, Hewlett-Packard Enterprise, Palo Alto, California, UNITED STATES
III-V Quantum Dot Lasers Monolithically Grown on Silcion (W4E.1)
4:30 PM - 5:00 PM Invited
We review the direct growth of III-V quantum dot laser on Si substrates. A low threading dislocation density, on the order of 105cm-2, for III-V epilayer on Si has been achieved.
Authors: H. Liu, University College London, Milton Keynes, UNITED KINGDOM
A Low-noise High-channel-count 20 GHz Passively Mode Locked Quantum Dot Laser Grown on Si (W4E.2)
5:00 PM - 5:15 PM
We report a low noise high-channel-count 20 GHz passively mode locked quantum dot laser grown on CMOS compatible silicon substrate. The laser demonstrates a record low timing jitter value of 82.7 fs (4 – 80 MHz) and a narrow RF 3-dB linewidth of 1.8 kHz as well as 58 wavelength channels within 3 dB optical bandwidth (80 lines within 10 dB).
Authors: S. Liu, M. Kennedy, J.E. Bowers, Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, California, UNITED STATES|D. Jung, Institute for Energy Efficiency, University of California, Santa Barbara, Santa Barbara, California, UNITED STATES|J. Norman, A. Gossard, Materials Department, University of California, Santa Barbara, Santa Barbara, California, UNITED STATES
Coherent and Incoherent Optical Feedback Sensitivity of High-coherence Si/III-V Hybrid Lasers (W4E.3)
5:15 PM - 5:30 PM
We demonstrate that high-coherence Si/III-V hybrid lasers are much more robust than conventional III-V DFB lasers against both coherent and incoherent optical feedback by examining the frequency noise power spectral density of the lasers.
Authors: Z. Zhang, H. Wang, C.T. Santis, A. Yariv, Department of Applied Physics and Materials Science, California Institute of Technology, Pasadena, California, UNITED STATES|N. Satyan, G. Rakuljic, Telaris Inc, Santa Monica, California, UNITED STATES|A. Yariv, Department of Electrical Engineering, California Institute of Technology, Pasadena, California, UNITED STATES
Sub-kHz linewidth Extended-DBR lasers heterogeneously integrated on silicon (W4E.4)
5:30 PM - 5:45 PM
We demonstrate single-mode E-DBR lasers with 1kHz linewidth and >37mW output power, and ring-assisted E-DBR lasers with 500Hz linewidth, by heterogeneously integrating III-V gain material with a 15mm long ultra-low loss silicon waveguide-based Bragg reflector.
Authors: D. Huang, M. Tran, J. Guo, J. Peters, T. Komljenovic, A. Malik, J.E. Bowers, University of California Santa Barbara, Goleta, California, UNITED STATES|P. Morton, Morton Photonics, West Friendship, Maryland, UNITED STATES
High-Performance Hybrid-Integrated Silicon Photonic Tunable Laser (W4E.5)
5:45 PM - 6:00 PM
We report a silicon photonic tunable laser for coherent communication, with output power reaching 140 mW across the C-band, linewidth narrower than 80 kHz, SMSR larger than 50 dB, and precise gridless frequency tuning.
Authors: Y. Gao, S. Lee, R. Patel, J. Lo, J. Sun, L. Zhu, J. Zhou, J. Hong, NeoPhotonics, San Jose, California, UNITED STATES
III-V/Si PICs based on micro-transfer-printing (W4E.6)
6:00 PM - 6:30 PM Invited
III-V opto-electronic devices (photodiodes, etched facet lasers) are micro-transfer-printed onto silicon waveguide circuits. An alignment-tolerant interface for evanescently-coupled devices is proposed enabling III-V/Si heterogeneously integrated PICs using micro-transfer-printing.
Authors: G. Roelkens, J. Zhang, G. Muliuk, J. Goyvaerts, B. Haq, C. Op de Beeck, A. Liles, Z. Wang, S. Dhoore, S. Kumari, J. Juvert, D. Van Thourhout, R.F. Baets, INTEC, Ghent University - imec, Ghent, BELGIUM|J. Van Campenhout, B. Kuyken, imec, Leuven, BELGIUM|B. Corbett, Tyndall National Institute, Cork, IRELAND|A. Trindade, C. Bower, X-Celeprint, Cork, IRELAND
HPC Interconnects at the End of Moore’s Law (Th3A.1)
2:00 PM - 2:30 PM Invited
The tapering of lithography advances that have been associated with Moore’s Law will substantially change requirements for future interconnect architectures for large-scale datacenters and HPC systems.
Authors: J. Shalf, Lawrence Berkeley National Laboratory, Berkeley, California, UNITED STATES
Evolution of Pluggable Optics and What Is Beyond (Th3A.2)
2:30 PM - 3:00 PM Invited
Need to support higher speeds of Ethernet at high radix on datacenter switches is prompting new pluggable optic form factors, on-board optics and co-packaging of optics with switch ASICs to fulfill the evolutionary need.
Authors: J.J. Maki, Juniper Networks Inc., Sunnyvale, California, UNITED STATES
A 4-lane 400 Gb/s silicon photonic transceiver for intra-datacenter optical interconnects (Th3A.3)
3:00 PM - 3:15 PM
We present a four-lane silicon photonic transceiver for intra-datacenter optical interconnects. A net rate of 400 Gb/s is achieved at a bit error rate below the KP-4 forward error correction threshold of 2.4x10-4 .
Authors: E. Elfiky, A. Samani, M. alam, M. sowailem, O. Carpentier, M. Jacques, L. Guenin, D. Patel, D. Plant, McGill University, Montreal, Quebec, CANADA
Fabric-wide, Penalty-optimized Path Routing Algorithms for Optical Integrated Switches (Th3A.4)
3:15 PM - 3:30 PM
We propose a generic path routing algorithm that opts for the most favorable switch configuration set by an algorithmically-defined weighting-factor, which optimizes fabric-wide penalties and corrects for fabrication variations. Results demonstrate significant power penalty improvements.
Authors: Q. Cheng, Y. Huang, M. Bahadori, J. Zhou, M. Glick, K. Bergman, Columbia University, NewYork, New York, UNITED STATES
InP PIC's Scalability for Datacenter Applications (Th3A.5)
3:30 PM - 4:00 PM Invited
InP PIC fabrication platforms have seen an accelerated development over the recent years. Monolithic integration allows novel concepts in packaging and testing technology. Altogether they enable a ready to scale cost-effective InP PIC ecosystem.
Authors: B. Docter, K. Solis-Trapala, A. Albores-Mejia, EFFECT Photonics B.V., Eindhoven, NETHERLANDS
Workshop - Will Coherent Optics Become a Reality for Intra-data Center Applications?
3 March, 1:00 PM - 3:30 PM
Mega-scale data-centers for cloud-based applications drive the need for ever higher bandwidth networks, particularly within the data-center. Optical fiber interconnects play a key role in the realization of these networks providing high data throughputs at relatively low energy and cost per bit over distances that are typically less than 2km. Thus far these optical interconnects have been deployed using intensity modulated, direct detect (IMDD) technologies. Coherent technologies, where the phase of the optical carrier provides higher signal-to-noise ratios, have been used since 2010 for long-haul communications at data rates of 100Gb/s and beyond. In the near future, with the demand for even higher data throughputs, can the IMDD approaches satisfy this need? Will there be opportunities for coherent technologies? This topic has been discussed previously with many experts believing that short reach coherent technology based links are still many years away. This workshop will review recent developments and reexamine the outlook for coherent technologies.
Some of the topics to be explored in this workshop:
- Evolution of datacenters. Which bitrates and distances are required today and in the future?
- What has been standardized or currently under standardization? Are all systems utilized in DCs standardized?
- What are the requirements or corner figures in terms of power consumption, form factors, bitrates, and latency?
- How does direct detect approaches compare to coherent ones---reach, power budget.
- Are there alternative transponder architectures to implement coherent?
- What technologies will yield lowest cost components? Integrated SiPh has been demonstrated and further implementations may be based on MMI couplers instead of full 90° hybrids.
- How do the different market segments view coherent? Data Center operators’ view, Access providers’ view, Transponder/transceiver Vendors’ and Academia’s view.
Workshop - Which One Will Succeed in Data Center Applications, Multi-chip or Monolithic Integrated Optoelectronic Chip?
3 March, 4:00 PM - 6:30 PM
Coherent DSP chips will soon be able to process 100-Gbaud signals. Switch ASICs capacity is scaling to tens of Terabit with a channel rate >100 Gb/s. Proximity integration of DSP/ASIC chips and optical chips are highly demanded in these high-speed and high-capacity applications. On-board optics and optics in packaging with ICs are expected to address this challenge. Silicon photonic technology allows monolithic integration of analog/digital ICs with photonic circuits. However, 2.5D and 3D integration approach based on multiple chips or separate IC and PICs is another feasible technique. This workshop will emphasize on how to integrate photonic chips with electronic ICs for very high baud rate and large capacity. Pros and cons for monolithic or multi-chip integration approaches will be discussed. Advanced packaging techniques such as optics in packaging and on-board optics will be also focused.
Workshop - Will Advanced Direct-detection Systems Ever Be the Solution of Choice for Metro and Access Applications?
4:00 PM - 6:30 PM
Anticipated traffic requirements for future metro and access applications seem to exceed the scaling capabilities of conventional intensity-modulation (IM) direct-detection (DD) systems. Various advanced DD systems, which include single-sideband modulation with digital signal-signal beating cancellation, Stokes receivers, and Kramers-Krönig receivers, have been recently proposed. These systems, which to various extents rely on the use of digital signal processing, offer increased throughput compared to IMDD systems, and require simpler optical hardware compared to coherent systems. On the other hand, coherent systems have the best cost-per-bit when Terabits per second per transceiver rates are targeted.
This workshop aims primarily to address the question of whether advanced DD systems will ever be realistically considered for commercial metro, access, and data center systems, or whether eventually coherent technology will just take over.
Special Chairs' Session: The Role of Optics in Future Data Center and Computing Applications Part I: Architecture Evolution
5 March, 2:00 PM - 4:00 PM
Data-center and high-performance computing technologies are rapidly evolving to accommodate emerging applications such as artificial intelligence, data-centric workloads and IoT. Hardware acceleration, new memory technologies, high-capacity low-latency networking, and programmatic control are key enablers to optimize application performance and improve resource scalability. In this session, industry leaders and cutting-edge researchers will discuss the evolution of data center and computing architectures, related hardware and the role of optics in this context.
Optical Interconnects for Extreme-Scale Datacenters and HPC (SC385)
3 March, 5:00 PM - 8:00 PM
Modern Supercomputers performance is poised to soon reach the ExaFLOP mark of 1018 floating-point operations per second. Novel applications for these most powerful computers have emerged in a wide range of areas including brain modeling, the design of new materials, multi-physics simulations, and climate modeling. Large-scale data analytics and machine learning workloads from the Big Data paradigm have further pushed computing needs toward processing of large volumes of data at ever increasing speeds. To obtain such computing power, however, requires the coordinated effort of millions of processors (cores). With the extraordinary growth in parallelism, performance is increasingly determined by how data is communicated among the numerous compute resources, rather than the arithmetic operations performed. At Exascale, these challenges are daunting, as energy consumption is currently dominated by the cost of data movement, and is an increasing constraint on usable application performance. The interconnect architecture must support colossal amounts of data that is almost continuously inter-exchanged by the cores, as well as data flows present between the cores and the various memory resources. Integrated photonics offers compelling technology solutions that include high-bandwidth density interconnect and the potential for system-wide energy efficient data movement. However the insertion of photonics in future Supercomputer systems will require new architectures and systems designs. The course will include an introduction to the system organization and architectures of today’s top supercomputers as well as the emerging interconnection networking challenges. The potential applications of integrated photonics in future supercomputing and datacenters including the design, power consumption, and performance analysis will be covered.
Link Design and Modeling for Intra Data Center Optical Interconnects (SC428)
3 March, 5:00 PM - 8:00 PM
Short reach optical interconnects using multimode fibers and VCSELs comprise the vast majority of all links deployed in data centers and supercomputers due to their low cost and power consumption. The optical interconnects fill the intermediate space between electrical interconnects (<5m) and single mode fibers (>300m). To maintain the low cost, the link power and jitter budget has to be structured in a way to provide the optimal trade-off between the individual link components and their specifications.
The primary objective of this course is to provide the participants with an introductory knowledge in link design. We will discuss the possible approaches to link design and go in depth over the individual link penalties and losses and noises.
The course will include in-depth coverage of signal propagation in multimode fibers (laser launch conditions, fiber DMD), effects of various signal dependent types of noise (mode partition noise, modal noise, relative intensity noise) and their impact on the link performance. We will include discussion of connector effects (mode mixing). We will also discuss the measurement methodologies used to specify the modern multimode fibers and sources operating at 850nm.
We will also discuss advanced modulation formats (PAM-4, DMT) and their applicability to short optical interconnects.
High-capacity Data Center Interconnects (SC461)
4 March, 9:00 AM - 12:00 PM
This short course gives a broad overview of data center interconnect (DCI) architectures and technology, ranging from short-haul interconnects of just a few kilometers across a campus network, to metro and finally long-haul deployments. It will cover the latest optical technology developments and how these are used to build ever denser, more power efficient, higher capacity and more scalable data center interconnect links.
We will provide an overview of the different technologies that are most relevant for today’s data center interconnects, covering the full range of transmitter and receiver technologies, pluggable form factors, modulation formats, protocols and data rates. In addition, we will also cover system design aspects such as open line systems, disaggregation of the optical layer and encryption. We will discuss in detail what makes data center interconnects different from traditional optical transport networks, and what are the most relevant design criteria in today’s DCI deployments. Finally, we will cover in detail the latest standardization activities as well as research and development directions towards future architectures.
The short course should enable attendees to obtain a detailed overview of the different technologies and architectures that are most relevant to wide area data center interconnects and get a comprehensive understanding for the different system design trade-offs in terms of cost, capacity, density, power consumption and complexity.
Panel - Beyond 400G for Hyperscale Data Centers
7 March, 8:00 AM - 10:00 AM
With 400G optics deployments on the horizon, what will be required next by hyperscale data centers? Do pluggable optical modules continue to scale to 800G/1.6T, or are new solutions required? What are the key technologies and enablers for next generation data center interconnect? What are the critical limitations and possible solutions?
Panelists from hyperscale data centers, system companies, and module manufacturers, will share their views of what’s beyond 400G for hyperscale data centers.
Next-Generation Coherent Architectures – Pluggable vs Multi-haul, a Knockout or a Draw?
3 March, 1:30 PM - 2:30 PM
Coherent architectures have trended toward increasing adoption of pluggable modules but margin stacking is creating competitive pressure, particularly in higher growth, edge coherent applications. Meanwhile, the latest generation of high-speed optics and DSPs with flexible transmission capabilities are offering solutions that support multi-haul applications ranging from high capacity edge DCI to submarine but fear of vendor lock-in concerns webscale providers. Panelists will discuss the synergies and trade-offs between these architectures and consider how they may evolve in future generations.