By Matthew Adams
Every second, over 5 exabytes of data are added to networks. The rapid growth of AI and high-performance computing (HPC) is placing unprecedented demands on data connectivity and associated infrastructure.
For over 20 years, the scaling of hardware FLOPS has outpaced interconnect bandwidth by more than 2:1. As such, interconnect has become one of the biggest bottlenecks in deploying AI and HPC. Meta suggests that for many of its advanced language models, over a third of the time data resides in the data center environment is dedicated to networking. Data center and AI factory architects are still struggling to keep pace with the required scale and speed.
In the near term, the rollout of 800G and 1.6T optical interfaces, along with co-package optics (CPO) will be crucial in alleviating network pressure. Testing and validation processes must quickly evolve and update, if the industry is to have a seamless transition to these greater bandwidths.
In this blog, we’ll explore how early and robust testing and validation ensure the reliability and performance of optical networks.
The Challenge: The AI and Data Center Scaling Dilemma
Optimizing datacenters for AI workloads, with their massive data flows and real-time processing, is driving significant change in scale and depth. The demand for 800G transceivers and 1.6T optical technologies is surging, driven by the need for significantly higher bandwidth and low-latency connections. This surge is accompanied by advancements in hollow-core fibers and innovative parallel optical connectors. With a strong focus on power consumption and reliability, advanced multi-fiber connectivity solutions and the use of wavelength-division multiplexing (WDM) have become crucial in certain parts of the AI fabric.
Scaling AI Infrastructure with VIAVI
March 30 marks the start of OFC 2025, where the continued push to develop and deploy higher bandwidths will be front and center, highlighting the critical role of testing. We expect five major themes: The journey to 1.6T, AI optical infrastructure testing, photonic integration approaches, fiber infrastructure observability, and the intersection of quantum technologies.
The Journey to 1.6T
The industry is accelerating the development and deployment of high-speed transceivers and digital signal processors (DSPs) to support this evolution.
VIAVI’s early-phase data layer testing of the 1.6T solutions with multiple module vendors and various DSP types demonstrates significant promise for large-scale deployment.
AI Infrastructure Testing
AI workloads generate massive, latency-sensitive data flows that require high-bandwidth, high density with low-latency, with an increasing demand for 1.6Tand 800G connectivity.
In manufacturing and validation, accurate photonic and data test platforms are critical for the upcoming ramp-up, enabling design optimization, improving yield, and driving volume. The reliability of test platforms in manufacturing is essential to prevent downtime in high-capacity environments.
On the deployment side, testing, inspection, and validation of key optical elements, notably multi-fiber MPO and very small form factor (VSFF) connectivity, are critical. CPO implementations will drive an order of magnitude change in ribbon connector volumes. The emergence of low latency hollow-core fiber is challenging traditional OTDR technologies, with multi-core fiber testing not far behind.
Silicon Photonics
Silicon-backed optical transceivers offer significant power and cost advantages compared to traditional integration. Dramatic increases in functional integration are pushing the manufacturers of chips, pluggables, and network infrastructure to reassess testing methods. Much of what has historically been done at the module level can be done at the wafer or packaging phase.
Fiber Infrastructure Observability
At this point, it’s vital to note that the reliable operation of high-speed data center interconnects hinges on robust fiber testing and performance monitoring. VIAVI’s fiber test solutions ensure fast, accurate certification of data center cabling, while performance monitoring solutions guarantee the reliability of fiber installations for high-speed data center interconnects.
Quantum Computing and Networking
The emergence of quantum computing, though still in its infancy, will introduce new challenges for next-generation infrastructure. Future hybrid quantum-classical systems and quantum networking technologies will need to be addressed. Early requirements around ultra-low loss connections and polarization management are challenges we should be ready to address.
Conclusion
The pace of change and drive to 1.6T is already visible in many of the pre-show announcements being made by OFC-attending companies. Alongside these announcements are a growing list of critical elements in an eco-system of optical technologies spanning silicon photonics, connectors, and fibers.
With innovative testing during manufacturing, deployment and monitoring, scaling risks, AI factory cost inefficiencies and deployment bottlenecks can be avoided- ensuring that you can scale your AI Infrastructure with confidence!
Come See Us!
If you are attending OFC 2025 and want to discuss how to deliver improved bandwidth in data center, HPC and quantum computing applications, we welcome the opportunity to meet with you at booth 2319. Click here to learn more.
About the author
Matt Adams
Sr. Product Manager at VIAVI Solutions, Photonic and Fiber Optic Test Solutions for Lab and Manufacturing Applications
Posted: 28 March 2025 by
Matthew Adams
| with 0 comments