Data Center Summit: Data Center Optical Interconnect – Technologies and Markets
Tuesday, 13 March, 10:15-12:15
Panelists will discuss technologies, applications and deployment scenarios for data centers:
- How is the cloud data center driving new generations of optical interconnects?
- What are the current technologies and equipment being used to address this market
- What are the new technologies being developed for higher data rates?
- 400G and beyond – will the equipment be the same, just upgraded to 400G or do we need a new ecosystem?
- CDFP, CFP8, OSFP, QSFP-DD – will all have markets and if so, where?
- 400G ZR challenges and roadmap
- What are the potential architecture and roadmap after 400G?
Frank Chang, OFC’18 N5 Program Chair; Principal Engineer, Optical, CTO Optics Office, Inphi Corporation, USA
Terran Huang, Senior Network Architect, Tencent, China
Revolution of Tencent Cloud Scale Networking
David Chen, AVP of Technology & Strategy Marketing, Applied Optoelectronics, USA
High Speed Transceiver Trend in Datacenter Applications
Stu Elby, Senior Vice President, Cloud Network Strategy and Technology, Infinera, USA
Emerging DCI Architectures
Benny Koren, Vice President of Architecture, Mellanox, Israel
Maximizing Energy Efficiency in 400G Data Center Interconnects
Rao G. Lingampalli, Director of Network Architecture, Equinix, USA
Cloud Data Centers, Interconnection Services and Enabling Optical Transport Technologies
Sam Liu, Director of Product Line Management, IP and Optical Networks Business Group, Nokia, USA
Optics Overview for Data Center Interconnection Routers
Sanjai Parthasarathi, Vice President, Product Marketing and Strategy, II-VI Photonics, USA
Advances in Line Systems for Emerging Data Center Interconnects
Ethernet Roadmaps Update
Session organized by Ethernet Alliance
Tuesday, 13 March, 12:45-13:45
This exciting and interactive panel will discuss the latest developments in Ethernet that are summarized in the 2018 Ethernet Roadmap, an updated overview of the latest Ethernet technologies that are being developed and deployed. While many people know about 400GbE being the fastest Ethernet speed being standardized, other speeds such as 2.5, 5, 25 and 50GbE have been developed for particular applications. This panel will look at the variety of speeds and their target applications that are driving these speeds.
Free copies of the 2018 Ethernet Roadmap will be handed out to attendees.
David Rodgers, Marketing Chair and Board Member, Ethernet Alliance; Senior Product Marketing Manager, Teledyne LeCroy, USA
Challenges and Solutions for Delivering 400G+ Client and Line Side Optics
Tuesday, 13 March, 14:30 - 16:00
Data center switches are scaling from 3.2Tb/s to 6.4, 12.8Tb/s. 25 Tb/s switching chips must be on the horizon. A new generation of 400G front panel pluggable optical transceivers are emerging to support the increased bandwidth. Increased electrical speeds of 56 and 64 GBaud and complex signaling and constellations place increased constraints on the packaging and design of optical components. This session will debate the pros and cons of the various pluggable options including form factors for client optics, coherent vs. direct detect, backward compatibility, pluggables vs. on-board optics and silicon photonics.
Andrew Schmitt, Cignal AI, USA
Andy Bechtolsheim, Chief Development Officer, Arista Networks, USA
Mark Nowell, Senior Director of Engineering, Cisco, USA
Siddharth Sheth, Senior Vice President Networking, Inphi, USA
Mark Filer, Optical Network Architect, Microsoft, USA
Maxim Kuschnerov, Senior R&D Manager, Huawei Technologies, Germany
COBO Specification Overview and Next Steps
Organized by the Consortium for On-Board Optics (COBO)
Wednesday, 14 March, 10:15-11:45
The Consortium for Onboard Optics (COBO) panel will provide an overview of its on-board optical module specification developed for the data center and coherent markets. The panel will discuss the market outlook and next steps to enable broader market adoption.
Brad Booth, Principal Network Architect, Microsoft; President, COBO, USA
Bernard HL Lee, Regional Technology Director, SENKO Advanced Components, Hong Kong
Karen Liu, Senior Director of Product Marketing, Kaiam Corp., USA
Arlon Martin, Senior Director, Marketing, Mellanox Technologies, USA
Hugues Tournier, Power and Signal Integrity Senior Manager, Ciena, Canada
Nathan Tracy, Technologist and Manager of Industry Standards, TE Connectivity, USA
The Role of “Open Transport” in the New Metro and Inter-Data-Center Architectures
Wednesday, 14 March, 11:00 - 12:30
This panel reviews the importance of “open transport” technology innovations (hardware and software) in the evolution of different metro network architectures. The session covers the main characteristics of the new metro architectures, the key “open transport” technology innovations (hardware and software), the role of “open transport” and disaggregation specifically in optical networks and the important commonalities and differences in “open transport” evolution of metro networks.
Loukas Paraschis, Senior Director, Cloud Transport, Infinera, USA
Jamie Gaudette, Microsoft, USA
Robert Howald, Comcast, USA
Andrew Leong, Facebook, USA
Scott Mountford, AT&T, USA
Matt Newland, Google, USA
Farzam Toudeh-Fallah, JPMorgan Chase, USA
Server Fibreless Optical Networking
Organized by Open19 Foundation
Wednesday, 14 March, 12:00-13:00
Join an Open19 expert panel as we discuss optical server connectivity with speeds of up to 400G per server, without the need for individual fibers per server. The optical interconnect will be leveraging the Open19 blind-mated snap-on cabling system that extends optical connectivity all the way to each serve in this unique new approach.
Open19 is redefining datacenter strategy and design using a novel, open-source, community approach to solving problems of deployment, management, performance and efficiency at scale. Started as a LinkedIn project, the community has grown to 27 corporate and over 1,600 individual supporters. Open19 is more than just another open source project. Open19 members participate in this open source community and yet retain their intellectual property and competitive edge. The revolutionary open platform fits in a 19-inch rack, has the same components at the edge as it does in scale at the core, reduces costs over 50%, increases efficiency by over 25%, and deploys, integrates, and scales in minutes instead of hours. A modular, flexible, and disaggregated approach from the servers and storage to power and interconnect. Come learn from our panel of experts and have an open discussion about the future of datacenter server networking and how you can be a part of designing the solution.
Michael King, Chief Marketing Officer, Open19 Foundation, USA
400G Standards, MSAs and Related Technologies: What is on the Horizon?
Wednesday, 14 March, 15:45-17:00
Get an update on the status of key 400G standards, MSAs and related technologies. You will hear what is close to coming out and what’s currently under consideration. Panelists will discuss IEEE Standard 802.3bs, TIA Standards, and underlying technologies supporting the move to 400G including current options and challenges.
Tom Hausken, Senior Industry Advisor, OSA Industry Development Associates (OIDA), USA
John D’Ambrosia, Senior Principal Engineer, Huawei; Chairman, Ethernet Alliance, USA
IEEE Standard 802.3 and Ethernet Roadmap
Mark Nowell, Distinguished Engineer, Cisco, USA
Rakesh Sambaraju, Applications Engineer and Nexans TESLA Sr. Expert, Nexans Data Center Solutions, USA
Rob Stone, Broadcom, USA
100Gb/s per lane / 400GbE switching
Nathan Tracy, TE Connectivity, USA