• Technical Conference:  15 – 19 March 2026
  • Exhibition: 17 – 19 March 2026
  • Los Angeles Convention Center, Los Angeles, California, USA

Optimized Interconnect for Ethernet Scale-Out and Scale-Up

Tuesday, 01 April, 12:15 – 12:45

Theater III

Broadcom will provide an overview of optical and electrical interconnect technologies for AI scale-out and scale-up networks. Ethernet has become ubiquitous for scaling out AI clusters and is now increasingly used for scaling up. Learn how to balance AI’s insatiable demand for higher speeds with the lowest cost, power, and latency.

Presented By

Broadcom

Speaker

Anand Ramaswamy, Solutions Architect, Broadcom, United States