• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

Introduction to NGK Bonded Wafer for Optical Communication

Thursday, 03 April, 10:15 – 10:45

Theater III

We will present our bonded wafer products, which are fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, uniform thickness, and exceptional stability, NGK’s wafers contribute to launching new markets for optical communication applications.

Presented By

Speaker

Tomoyoshi Tai, Manager, NGK Insulators, Japan