Thursday, 03 April,
12:30
–
13:30
Theater II
Session Description
Optical interconnects have fallen short of meeting the growing AI applications space's cost/power/bandwidth needs. This panel will provide opposing views on the solutions that have the potential to meet AI application requirements. Can linear-drive pluggable optics (LPO) systems with the lowest cost and power demonstrate interoperability and show they have a path to 200G? Are half-linear systems the best middle ground, or will fully retimed modules reduce DSP power and enable the broad market volumes needed for low-cost modules? Will VCSELs be the lowest-cost optical source, or will SiPh technology finally show that it is the solution that can move the industry forward? Optical module makers must place the right bets on their next-generation modules. This panel will provide the audience with information critical for decision-making related to silicon developments, laser types, and module integration.
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