Wednesday, 27 March,
15:15
–
16:15
Theater II
Across the globe, hyperscalers are racing to meet the massive data demands from organizations and individuals, contributing to the growing wave of artificial intelligence and machine learning (AI/ML) applications. Whether deploying clusters, pods, nodes, or evolved supercomputers, interconnect plays a critical role in making these deployments possible. High performance is a non-negotiable, but several system implementors and platform integrators also place significant importance on energy efficiency and environmental impact. Architectural shifts towards pooled resources and optimized network throughput create an opportunity for providers to consider migrating data centers from air-based cooling to liquid- or immersion-based cooling technologies. Amphenol is one of the world’s largest suppliers of high-technology connectors, cabling, sensor, and antenna products. This talk will explore how Amphenol is encouraging the path towards improved energy efficiency by extending the physical reach of low-latency compute networks with compatible copper and optical solutions and preparing our interconnects to operate across a range of data center cooling environments.
Presented By
Speaker
Samuel Kocsis, Director of Standards and Technology at Amphenol, United States