From Vision to Reality: Enabling Robust Volume Manufacturing of Photonic ICs for AI Networks

Thursday, 03 April, 15:00 – 16:00

Theater I

Session Description:

Artificial Intelligence is driving a surge in demand for next-generation optical interconnects, with photonic integrated circuits (PICs) poised to revolutionize the data infrastructure crucial for AI and high-speed optical networks. These technologies are essential for scaling data transmission and reducing energy consumption, making them ideal for high-channel-count, high-density optical interconnects. However, they come with unique challenges that must be addressed to fully realize their potential. This panel provides valuable perspectives on the collaboration, innovations and methodologies driving robust high-volume PIC production.

Hear from industry leaders across the photonics ecosystem as they discuss the challenges of manufacturing PIC technologies and what it will take to finally scale up to high volumes. Speakers include experts in photonics development, foundries, OSAT, contract manufacturing, assembly/alignment equipment, test and measurement, and industry standards.

Panelists