• A Hybrid Conference – In-Person and Virtual Presentations
  • Technical Conference:  24 – 28 March 2024
  • Exhibition: 26 – 28 March 2024
  • San Diego Convention Center, San Diego, California, USA

Design Considerations of Optical Connectivity in a Co-Packaged or On-Board Optics Switch

Tuesday, 07 March, 15:45 – 16:45

Theater I

Session Description:

The shift to cloud-based networks focuses this data load on hyper scale-level data centers where networking equipment upgrades focus on denser, cheaper, and faster implementations that can expand data network bandwidth. Optics mounted directly on the host PCB or directly near the compute module or sockets were the target for specific applications such as in supercomputers. On-board optical (OBO) or co-packaged optical (CPO) modules provide interconnects within the server PCB. Removing the optical pluggables from the faceplate allows one to re-evaluate the design configuration for optical connections, heat management, and power into a network switch or data center server. This session will review design options available to accommodate the optical connectivity required and evaluate potential impacts on optical signal, thermal, and safety criteria. Topics will include issues, potential solutions, and design implementation considerations to inform the implementer community. This session is based on a white paper released in July 2022 written by 47 Companies and took over two years to write.

Organized by:


Tiger Ninomiya, Senior Technologist, Senko, USA


Nikhil Angra, Senior Product Line Manager, AFL Hyperscale, USA

Johsua Kim, COBO MWIS Chair, Principal Engineer, Hirose Electric, USA

Tiger Ninomiya, Senior Technologist, Senko Advanced Components, USA

Jeff Peng, Engineer, Applied Optoelectronics Inc., Taiwan

Kevin Yao, Business Director, Ragile Networks, USA