Tuesday, 07 March,
The shift to cloud-based networks focuses this data load on hyperscale-level datacenters were networking equipment upgrades focus on denser, cheaper, and faster implementations which can expand data network bandwidth. Optics mounted directly on the host PCB or directly near the compute module or sockets were target for specific applications such as in supercomputers. On-board optical (OBO) or co-packaged optical (CPO) modules both provide interconnects within the server PCB. The removal of the optical pluggables from the faceplate provides an opportunity to re-evaluate the faceplate design configuration for optical connections, heat management, and power into a network switch or datatcener server. This session will review design options avaliable to accommodate the optical connectivity required and evaluate potential impacts on optical signal, thermal, and safety criteria. Topics will include issues, po- tential solutions, and design implementation considerations to inform the implementer community. This session is based on a white paper released July 2022 written by 47 Companies and took over 2 years to write.
Brad Booth, Principal Hardware Engineer, Microsoft, USA