• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

AIM Photonics Presents PICs, Heterogeneous Integration & Packaging for Next-Gen Integrated Photonics

Wednesday, 02 April, 13:45 – 14:45

Theater II

Session Description
Our experts will provide insight into the future of silicon photonics and demonstrate how AIM Photonics technology offerings across the product development cycle enables prototype development from design through fabrication, assembly, and test.

Organized by: 

 

Panelists

John Bowers, Director of the Institute for Energy Efficiency, University of California, Santa Barbara, United States

High Capacity Interconnects and Integrated Quantum Dot Lasers

David Harame, Chief Operating Officer, AIM Photonics, United States

PIC Prototype Development using AIM Photonics Multi-Project Wafer (MPW) and Test, Assembly, and Packaging Capabilities

Mike Zylstra, Director of Photonic Components, Analog Photonics, United States

Silicon Photonic Hybrid Lasers and Amplifiers Using Flip-Chip Integration