• Technical Conference:  05 – 09 March 2023
  • Exhibition: 07 – 09 March 2023
  • San Diego Convention Center, San Diego, California, USA

Wednesday, 09 March 10:30 – 11:30
Theater II

Session Description:

Ethernet’s adoption continues to spread across application spaces with increasing diversity in its rates and implementation. Ethernet over optical and electrical cabling is finding new forms of implementation. This is not just diversity in form factor for the module at the ends but also in deployment scenarios. New higher capacity modules are being introduced to support multiple ports of a lower rate of Ethernet as their primary purpose. In some cases, the new higher rate of Ethernet the module could support has not yet been defined but is in process to be standardized (e.g., 800G and 1.6T Ethernet). The new co-packaged optics scheme goes even farther with it target implementation capacity that goes well beyond even the rates of Ethernet in consideration (e.g., 3.2T). The panel will cover the defining aspects of Ethernet and how the industry seeks to preserve interoperation regardless of implementation. When I see it, how do I know it is Ethernet?

Moderator: 

David Rogers, Technical Business Development Manager, Teledyne LeCroy PSG, USA

Panelists: 

Paul Brooks, Optical Transport Technology and Strategy, Viavi Solutions, Germany

Faisal Dada, Director, Strategic Marketing; Principal Architect, Xilinx, USA

Jeff Maki, Distinguished Engineer II, Juniper Networks, USA

Matt Traverso, Distinguished Engineer, Cisco Systems, USA

Biographies: 

Paul Brooks, Optical Transport Technology and Strategy, Viavi Solutions, Germany
Paul has worked in the communications test and measurement industry since he joined Wandel & Goltermann in 1995.  After several roles in R&D including leading up the groups for analog and DSP he has been focused on marketing roles for high speed optical transport. With his role in VIAVI he is active at the OIF and IEEE and has been part of efforts to actively support the pluggable digital coherent optics ecosystem.  Originally from Ireland he lives in Southern Germany where he laments the lack of first class rugby.

Faisal Dada, Director, Strategic Marketing; Principal Architect, Xilinx, USA
Faisal Dada is a Principal Architect & Director in the Wired & Wireless Group at Xilinx, where he manages strategic and technical engagements with customers and service providers. He has more than 20 years’ experience working in different capacities in the industry. At Xilinx he is responsible for the optical transport and access global markets and works closely with product planning on defining next generation products. He has published papers, spoken at conferences and attended standard bodies as part of his responsibility at Xilinx.

Jeff Maki, Distinguished Engineer II, Juniper Networks, USADr.
Jeffery Maki works on cloud optics. He is a member of the board of directors of the Ethernet Alliance and an IEEE 802.3 Ethernet voter. For OIF, he is PLUG chair and technical voter for Juniper Networks. He is co-chair of the 100G Lambda MSA and a founding member of the QSFP-DD800, QSFP-DD, SFP-DD and Open-Eye MSAs. For COBO, he is a member of the board of directors, VP and Data Center Networking working group chair. He is an OSA and IEEE member. He has a Ph.D. in Optics from The Institute of Optics, University of Rochester, Rochester, New York.

Matt Traverso, Distinguished Engineer, Cisco Systems, USA
Matt Traverso is a Distinguished Engineer for Cisco Systems. Matt has been active in the development and definition of optical networking standards and module form factors since 2000 including as the original editor of the CFP MSA (Multi-Source Agreement). He has been a frequent contributor to the IEEE Standards Association, Optical Internetworking Forum and other optical communications forums. Matt graduated from Stanford University in Materials Science & Engineering.

 

 

David Rogers, Technical Business Development Manager, Teledyne LeCroy PSG, USA
David J. Rodgers is a seasoned Test and Measurement (T&M) professional with wide-ranging experience in serial communications protocol and interconnect validation, and a focus on Ethernet network and Fibre Channel fabric solutions where he has been defining, designing, deploying and marketing a broad range of high-speed serial analysis T&M products for SANs and LANs. David has 35+ years industry experience in bringing new computer technologies to market with a wide-ranging background in business, program management and product development of serial protocol T&M solutions. He is an original member of the USB Implementers Forum and one of the pioneer marketers of USB protocol analyzers. David represents EXFO for high-speed interconnect test technologies including Ethernet and Fibre Channel in various protocol industry groups such as IEEE, T10/T11 standards bodies, the Ethernet Alliance and the Fibre Channel Industry Association.