• Technical Conference:  05 – 09 March 2023
  • Exhibition: 07 – 09 March 2023
  • San Diego Convention Center, San Diego, California, USA

An OIF Update on Electrical Rates: 112G Technical Closure and the Latest Progress for 224G

Tuesday, 08 March 16:00 – 17:00
Theater III

Session Description:

OIF industry experts will provide an update on the 112 Gbps technical work as it completes, and the tradeoffs to reach this point in maturity. The panel will then turn their attention to the next speed node under development and give insights on how our latest work on 244G is progressing and share the latest industry ideas to address these challenges. Join us for the latest technical updates and a live Q&A where the power/performance/reach specifications we create here will be critical for chip/backplane systems in the future as well as 800Gbps, 1.6Gbps and 3.2Gbps networking solutions.

Moderator:
Nathan Tracy, OIF VP of Marketing and Board Member; Technologist, System Architecture Team and Manager of Industry Standards for the Data and Devices Business Unit, TE Connectivity, USA

Panelists: 

Jeffery Maki, Distinguished Engineer II, Juniper Networks, USA
System approaches using CEI-112G and a look beyond to using CEI-224G

Nathan Tracy, OIF VP of Marketing and Board Member; Technologist, System Architecture Team and Manager of Industry Standards for the Data and Devices Business Unit, TE Connectivity, USA
CEI-112G Channel Updates and the Path Forward to CEI-224G Channels

Cathy Liu, Distinguished Engineer and Director, SerDes Architecture and Modeling Group, Broadcom Inc., USA
CEI-112G MR/LR Updates and CEI-224G Challenges

Mike Li, Fellow and Technologist for High-Speed I/O and Interconnects, Intel, USA
CEI-112G XSR/XSR+/VSR Updates, and CEI-224G Challenges and Paths

John Calvin, Sr. Strategic Planner, Keysight Technologies, USA
Measurement and Validation Principals in Advancing From CEI-112G to CEI-224G

Biographies: 

John Calvin, Sr. Strategic Planner, Keysight Technologies, USA
John Calvin is a strategic planner and hyperscale network technology lead for Keysight Technologies. John has been bridging the physical layer measurement science gaps of emerging Telecom and DataCom development efforts for 20 years.He has chaired multiple physical layer interoperability working groups and is currently serving as a contributing member to IEEE 802.3, OIF-CEI, InfiniBand and PCIe development efforts. John holds a BSEE from Washington State University and his graduate level studies in signal processing from Stanford University.He works and lives from his Keysight field office in Clarkston Washington at the confluence of the Snake and Clearwater rivers.

Mike Li, Fellow and Technologist for High-Speed I/O and Interconnects, Intel, USA
Dr. Peng (Mike) Li is an Intel Fellow and the technologist for high-speed I/O and interconnects at Intel Corporation. He serves as Intel’s technical expert and adviser in high-speed I/O and link technology; standards; SerDes architecture; electrical and optical signaling and interconnects; silicon photonics integration; optical field-programmable gate arrays (OFPGAs); and high-speed simulation, debug and test for jitter, noise, signaling and power integrity, from deign validation to high-volume manufacturing (HVM).

Cathy Liu, Distinguished Engineer and Director, SerDes Architecture and Modeling Group, Broadcom Inc., USA
Cathy Ye Liu, distinguished Engineer, currently heads up Broadcom SerDes architecture and modeling group. Previously she worked as R&D director and distinguished engineer in Avago/LSI which acquired Broadcom in 2016. Since 2002, she has been working on high speed transceiver solutions. Previously she has developed read channel and mobile digital TV receiver solutions. Her technical interests are signal processing, FEC, and modeling in high-speed optical and electrical transceiver solutions. She has published many journal and conference papers and holds 20+ US patents. Cathy has demonstrated her leadership roles in industry standard bodies and forums. Currently Cathy serves as the president of the board of directors of Optical Internetworking Forum (OIF). She also serves as a member of the board of advisors for the department of Electrical & Computer Engineering (ECE) of University of California at Davis, a member of Signal Integrity Journal editorial advisory board, and the co-chair of the DesignCon technical track of high speed signal processing, equalization and coding.

Jeffery Maki, Distinguished Engineer II, Juniper Networks, USA
Dr. Jeffery Maki is a Distinguished Engineer II at Juniper Networks working on cloud optics. For OIF, he is a member of the board of directors, Physical Layer User Group working group chair and technical voter for Juniper Networks. He is a member of the board of directors of the Ethernet Alliance as Treasurer and an IEEE 802.3 Ethernet voter. For the Consortium for On-Board Optics (COBO), he is a member of the board of directors as Treasurer. He is co-chair of the 100G Lambda MSA and a founding member of the QSFP-DD, OSFP, SFP-DD, Open-Eye and OpenZR+ MSAs. He is an OSA and IEEE member. He has a Ph.D. in Optics from The Institute of Optics, University of Rochester, Rochester, New York.

Nathan Tracy, OIF VP of Marketing and Board Member; Technologist, System Architecture Team and Manager of Industry Standards for the Data and Devices Business Unit, TE Connectivity, USA
Nathan Tracy currently serves as OIF’s VP of Marketing and member of the board of directors. During the past ten years he has also served OIF as president, technical committee chair and technical committee vice chair. As a technologist on the system architecture team and manager of industry standards for the Data and Devices business unit at TE Connectivity (TE), Nathan is responsible for driving standards activities and working with key customers to enable new system architectures. Nathan has more than 30 years of experience in technology development, marketing and business development for TE in areas including RF/microwave, and high-speed signaling technology for the networking, telecom, wireless, automotive and defense markets.
 

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