About Us
Since our very beginning as a company, our unchanging hope has always been to be able to give our clients what they need. This is still true in today’s ever-changing business world, where need is taking on more and more diverse forms.
Our made-to-order production system, which we use to satisfy the diverse needs of our customers with meticulous care, is an expression of our craftsmanship. This is why we’re so confident that no other company can match our products.
Engagement with our customers in producing products is what keeps us going, and we are sincerely grateful to have the opportunity to work with every one of them.
We take pride in being a part of the mechanism that drives our age forward with each successive technological revolution. Tecdia is always ready take on the challenge to expand our sights into new fields in the world to give our customers what they need.
Please feel free to take a look at our Catalogs:
Company Profile
Single Layer Wire Bondable Capacitors
Substrates
Scribe Tools
Nozzles
Precision Machining
Contract Manufacturing
Varactors
200V Capacitors
Tecdia Product Information Video
Product Showcase
Tecdia has an extensive array of 2, 3 and 4 cut-point tools that are suited for wafer thicknesses from 50-500 microns.
Tecdia Chip Capacitors are normally constructed as square chips for single values and binary capacitor arrays, and in rectangular shapes for capacitor row arrays and custom designs. Tecdia uses variations in chip thickness (by lapping), as well as electrode/ceramic size and dielectric constant to construct capacitors. This permits a broad range of capacitance values to be manufactured with various form factors and designs.
Chip resistors for impedance matching and noise filtering applications.
Tecdia’s Thin Film Substrates technologies combine over 40 years of experience in ceramics, machining, wafer processing, and thin film metallization techniques into one group that specializes in build-to-print thin film metalized ceramic substrates. Features such as fine patterns, electrical wraps, thin film resistors and pre-deposited AuSn are all specialized for miniaturized high-speed communication devices.