The Optical Networking and Communication
Conference & Exhibition

Moscone Center,
San Francisco, California, USA

Embedded Optics and How They Should be Implemented to Support the OEM Eco-system

Tuesday, 10 March 15:00 - 17:00
Theater II

Session Description
With the next generation of Ethernet switch chips from vendors like Broadcom, Huawei and Avago, the need for better integration to support the interface bandwidth and density of I/O becomes apparent. Embedded optics standards from COBO and CPO are compared to co-packaged optics from Ayar Labs.  All are competing for mindshare and the hearts of switch designers. Optical transceiver vendors also have a stake in this market with planned, higher levels of integration in a pluggable format. This panel will allow all of the players to state their case and we will also hear perspectives of some users and OEMs. 

Steve Plote, Optics Consulting Engineer, Nokia, Inc., USA



James Steward, Director of Hardware Engineering, Facebook, USA

Vladimir Stojanovic, Chief Architect and Co-Founder, Ayar Labs, USA
TeraPHY Optical I/O - The New Universal Chip to Chip I/O Solution
Optics has reached the potential to provide the rack and row-scale connectivity at the energy and latency cost of electrical in-package interconnects.  To achieve this, photonics has to be crafted to fit the electronics SoC packaging ecosystem and embrace the inherent bandwidth density and energy-efficiency advantages by utilizing monolithic integration with CMOS and advanced photonic structures. Here, we'll describe how Ayar Labs' TeraPHY Optical I/O technology is positioned to take the mantle from electrical SerDes as the next universal chip to chip I/O solution.

Brian Welch, Embedded and Integrated Optics Lead, Cisco Systems, USA
Optics: How Much Integration is Too Much?

The transition from pluggable, to embedded, and ultimately integrated optics promises many benefits, but may also require many tradeoffs. We will compare the values and risks of each, and how they may differ for consumers and suppliers of optics.

Martin Zirngibl, Chief Technologist, II-VI, USA
What Does Co-packaging Mean for the Datacom Ecosystem?
Co-packaging will fundamentally alter today’s supply chain in the datacom industry, both from a technology as well as business aspect. We will discuss some of the challenges as well as opportunities in a world where switches no longer use pluggable transceiver but where the optics is directly hardwired to the switch ASIC.





Steve Plote, Optics Consulting Engineer, Nokia, Inc., USA

Steve Plote, is Optics Consulting Engineer at Nokia. He is currently responsible for the support of all Nokia sales teams in the Americas as well as Channel Partners.  Focusing on Network designs for the delivery of real time, next generation services for Video transport, Carrier Ethernet, Consumer Content Distribution, and Cloud Computing.  He has personal responsibility for the network engineering and support for the WEB2.0 and Content Service Providers in North America.  Mr. Plote has more than 30 years of experience in Data Center Interconnect, Telecommunications and LAN switching and transmission solutions.  Prior to joining Nokia, he was Solutions Business Development and CSP Systems Engineering at BTI Systems and prior to that was Solutions Sales Director at Tellabs.  He has many professional memberships and committee involvements including NANOG PC, OFC, MEF, IEEE, OSA, IEC and IETF.


Vladimir Stojanovic, Chief Architect and Co-Founder, Ayar Labs, USA

Vladimir is the Chief Architect of Ayar Labs. Prior to founding Ayar Labs, he led the team that designed the world’s first processor to communicate using light. Vladimir is also a professor of EECS at UC Berkeley, and was one of the key developers of the Rambus high-speed link technology. He holds a PhD from Stanford University.



Brian Welch, Embedded and Integrated Optics Lead, Cisco Systems, USA

Brian is responsible for embedded and integrated optics strategies at Cisco systems (formerly Luxtera), and in 14 years at the company has held various engineering and product management roles. Brian holds over 40 patents and has a PhD from Cornell University in Electrical Engineering.


Martin Zirngibl, Chief Technologist, II-VI, USA

Martin Zirngibl is currently Chief Technologist at II-VI. Before the II-VI acquisition of Finisar, he was the corporate CTO of Finisar, a position he held since 2018. Martin Zirngibl joined Finisar in 2016 as VP, fellow for technology responsible for strategy for coherent products. Prior to joining Finisar, Martin held progressive managerial roles at Nokia, Bell labs, as director of optical networking research and as executive director of device and subsystems research. He joined AT&T Bell laboratories as member of technical staff. Martin Zirngibl holds a PhD in physics for the Swiss Institute of Technology, Lausanne and a diploma in theoretical physics from the same Institute. He was named Bell Labs fellow in 2008. Martin has published over 100 scientific publications, has filed over 50 patents and wrote one book chapter.

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