The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Embedded Optics and How They Should be Implemented to Support the OEM Eco-system

Tuesday, 10 March, 15:00 - 17:00
Theater II

 

Session Description
With the next generation of Ethernet switch chips from vendors like Broadcom, Huawei and Avago, the need for better integration to support the interface bandwidth and density of I/O becomes apparent. Embedded optics standards from COBO and CPO are compared to co-packaged optics from Ayar Labs.  All are competing for mindshare and the hearts of switch designers. Optical transceiver vendors also have a stake in this market with planned, higher levels of integration in a pluggable format. This panel will allow all of the players to state their case and we will also hear perspectives of some users and OEMs. 
 
Moderator

Steve Plote, Optics Consulting Engineer, Nokia, Inc., USA

 

Panelists

Brad Booth, President, COBO; Network Hardware Manager, Microsoft Azure, USA
The Death of Faceplate Optics

There is a lot of hype around moving optics away from the faceplate of switches and networking equipment, but is that really necessary? This presentation focuses on why this trend is inevitable and how the optics and networking industry needs to embrace this change.

Ron Johnson, Cisco

Katharine Schmidtke, CPO Rep and Facebook
Co-packaged Optics Ecosystem for Hyperscale Data Center Applications

Vladimir Stojanovic, Chief Architect and Co-Founder, Ayar Labs
TeraPHY Optical I/O - the new universal chip to chip I/O solution

Optics has reached the potential to provide the rack and row-scale connectivity at the energy and latency cost of electrical in-package interconnects.  To achieve this, photonics has to be crafted to fit the electronics SoC packaging ecosystem and embrace the inherent bandwidth density and energy-efficiency advantages by utilizing monolithic integration with CMOS and advanced photonic structures. Here, we'll describe how Ayar Labs' TeraPHY Optical I/O technology is positioned to take the mantle from electrical SerDes as the next universal chip to chip I/O solution.

Martin Zirngibl, Chief Technologist, II-VI
What does co-packaging mean for the datacom ecosystem?

Co-packaging will fundamentally alter today’s supply chain in the datacom industry, both from a technology as well as business aspect. We will discuss some of the challenges as well as opportunities in a world where switches no longer use pluggable transceiver but where the optics is directly hardwired to the switch ASIC.

 

Biographies

Brad Booth, President, COBO; Network Hardware Manager, Microsoft Azure, USA

Brad Booth is a distinguished leader in Ethernet technology development and standardization. Currently heading up the 25/50G Ethernet Consortium and the Consortium for On-Board Optics, he is a Network Hardware Manager at Microsoft where he leads the development of hyper-scale networking products for Microsoft’s cloud datacenters. Previously, Brad has held strategist and engineering positions at Dell, Intel and Bell-Northern Research. The holder of over 20 patents related to networking technologies, he has also received awards for his contributions to industry consortia and IEEE Ethernet standards.
 

Ron Johnson, Senior Director of Architecture and Product Management, Cisco Systems

Ron Johnson manages Cisco’s optical portfolio and the integration of IP and Optical.  He has held this position for 12 years and has worked with Cisco’s optical group for more than 19 years.  He holds multiple patents related to Cisco’s product offerings.  Ron’s team is responsible for recent innovation and integration in DWDM, Packet and TDM technologies.

Ron has been in telecom for the last 22 years.  Starting out in Pacific Bell/SBC where he obtained a large carrier operational perspective that has found it’s way into Cisco’s IP+Optical portfolio.
 

Steve Plote, Optics Consulting Engineer, Nokia, Inc., USA

Steve Plote, is Optics Consulting Engineer at Nokia. He is currently responsible for the support of all Nokia sales teams in the Americas as well as Channel Partners.  Focusing on Network designs for the delivery of real time, next generation services for Video transport, Carrier Ethernet, Consumer Content Distribution, and Cloud Computing.  He has personal responsibility for the network engineering and support for the WEB2.0 and Content Service Providers in North America.  Mr. Plote has more than 30 years of experience in Data Center Interconnect, Telecommunications and LAN switching and transmission solutions.  Prior to joining Nokia, he was Solutions Business Development and CSP Systems Engineering at BTI Systems and prior to that was Solutions Sales Director at Tellabs.  He has many professional memberships and committee involvements including NANOG PC, OFC, MEF, IEEE, OSA, IEC and IETF.

 

Katharine Schmidtke, CPO Rep and Facebook

Dr. Katharine Schmidtke is responsible for Optical Technology strategy at Facebook. She obtained a Ph.D. in non-linear optics from Southampton University in the UK and completed post-doctoral research at Stanford University.  She has over 20 years’ experience in the Opto-Electronics industry including positions at New Focus, JDS Uniphase, and Finisar Corporation.

 

 

Vladimir Stojanovic, Chief Architect and Co-Founder, Ayar Labs

Vladimir is the Chief Architect of Ayar Labs. Prior to founding Ayar Labs, he led the team that designed the world’s first processor to communicate using light. Vladimir is also a professor of EECS at UC Berkeley, and was one of the key developers of the Rambus high-speed link technology. He holds a PhD from Stanford University.

 

 

Martin Zirngibl, Chief Technologist, II-VI

Martin Zirngibl is currently Chief Technologist at II-VI. Before the II-VI acquisition of Finisar, he was the corporate CTO  of Finisar, a position he held since 2018. Martin Zirngibl joined Finisar in 2016 as VP, fellow for technology responsible for strategy for coherent products. Prior to joining Finisar, Martin held progressive managerial roles at Nokia, Bell labs, as director of optical networking research and as executive director of device and subsystems research. He joined AT&T Bell laboratories as member of technical staff. Martin Zirngibl holds a PhD in physics for the Swiss Institute of Technology, Lausanne and a diploma in theoretical physics from the same Institute. He was named Bell Labs fellow in 2008. Martin has published over 100 scientific publications, has filed over 50 patents and wrote one book chapter.

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