The Optical Networking and Communication
Conference & Exhibition

A Virtual Conference - Pacific Daylight Time (UTC-07:00)

Electrical Data Rates Keep Pushing Forward; An OIF Update

Tuesday, 08 June 11:00 – 12:00

Session organized by Optical Internetworking Forum (OIF)

Session Description:

A panel of industry experts and OIF members will provide an update on OIF’s CEI-112G and CEI-224G development work including discussion and debate of 224G modulations.


Nathan Tracy, TE Connectivity/OIF, USA

Nathan Tracy currently serves as OIF’s VP of Marketing and member of the board of directors. During the past ten years he has also served OIF as president, technical committee chair and technical committee vice chair. As a technologist on the system architecture team and manager of industry standards for the Data and Devices business unit at TE Connectivity (TE), Nathan is responsible for driving standards activities and working with key customers to enable new system architectures. Nathan has more than 30 years of experience in technology development, marketing and business development for TE in areas including RF/microwave, and high-speed signaling technology for the networking, telecom, wireless, automotive and defense markets. Nathan is also an active member of other industry standards and associations. Currently he serves the Ethernet Alliance as a member of the board, and he is a regular attendee and contributor to IEEE 802.3 and COBO. Additionally, he is active in a number of industry MSAs and forums where he has held leadership roles. Nathan earned his Bachelor of Science Electrical Engineering Technology degree from the University of Massachusetts, Dartmouth.


Thananya Baldwin, Keysight Technologies, USA
Presentation Title: Test and Measurement Challenges for the Higher Rates
Abstract:  With higher speeds, there is a convergence of testing for "what the bit looks like” the same time as "what it carries". Striping data across multiple lanes pose a challenge to traditional, per channel, analog test equipment. To better understand potential issues, a best-in-class test solution must have visibility into both “what the bit looks like” as well as “what it carries”.

Thananya Baldwin is an accomplished engineering leader and recognized thought leader for High-Speed Ethernet (HSE) test products and technologies. She is currently vice president of strategic programs with Keysight’s Networking Labs. In this role, she has led ground-breaking programs enabling introduction of the first 25GE, 40GE, 50GE, 100GE and 400GE test systems. While running these leading- edge programs, Thananya actively participates in the IEEE 802.3 Higher Speed Ethernet standard bodies and Optical Internetworking Forum (OIF) projects. Prior to Keysight, she was a technology innovator and evangelist at Ixia, acquired by Keysight in 2018. Thananya holds a Bachelor’s of Science in Engineering and a Master’s of Business Administration. She is an avid world traveler and SCUBA diving enthusiast.

Mike Li, Intel, USA

Dr. Peng (Mike) Li is an Intel Fellow and the technologist for high-speed I/O and interconnects at Intel Corporation. He serves as Intel’s technical expert and adviser in high-speed I/O and link technology; standards; SerDes architecture; electrical and optical signaling and interconnects; silicon photonics integration; optical field-programmable gate arrays (OFPGAs); and high-speed simulation, debug and test for jitter, noise, signaling and power integrity, from deign validation, to high-volume manufacturing (HVM). Li joined Intel in 2015 with the acquisition of Altera Corp., where he had held a similar role since 2012. Before joining Altera in 2007, Li spent nearly a decade at Wavecrest Corp., culminating in his seven-year tenure as chief technology officer (CTO). He began his career in 1991 as a post-doctorate researcher at the Space Sciences Laboratory at the University of California, Berkeley. Li earned a bachelor’s degree in space physics from the University of Science and Technology of China in Hefei, China; a master’s degree in physics and a master’s degree in electrical and computer engineering, both from the University of Alabama in Huntsville (UAH); and a Ph.D. in physics, also from UAH. Li was named an IEEE Fellow in 2012, an Intel Fellow in 2015, and Engineer of the year (2018, Designcon). He has been elected as an affiliated professor at the Department of Electrical Engineering, University of Washington, Seattle, since 2010.

Cathy Liu, Broadcom, USA

Cathy Ye Liu, distinguished Engineer and director, currently heads up Broadcom SerDes architecture and modeling group. Previously she worked as R&D director and distinguished engineer in Avago/LSI which acquired Broadcom in 2016. Since 2002, she has been working on high speed transceiver solutions. Previously she has developed read channel and mobile digital TV receiver solutions. Her technical interests are signal processing, FEC, and modeling in high-speed optical and electrical transceiver solutions. She has published many journal and conference papers and holds 20+ US patents. Cathy has demonstrated her leadership roles in industry standard bodies and forums. Cathy served as a member of the board director of Optical Internetworking Forum (OIF) from 2017-2020. Currently she serves as a member of the board of advisors for the department of Electrical & Computer Engineering (ECE) of University of California at Davis, a member of Signal Integrity Journal editorial advisory board, and the co-chair of the DesignCon technical track of high speed signal processing, equalization and coding.

Gary Nichol, Cisco Systems/OIF, USA

Dave Stauffer, Kandou Bus/OIF, Switzerland

Dr. Stauffer has expertise in logic design and architecture for High Speed Serdes and DDR memory interface applications, both in his current position as Director of Chip Architecture at Kandou Bus, and in his previous position as a Senior Technical Staff Member at IBM. He is a contributor to serial link standards (OIF Common Electrical I/O (CEI), INCITS T11 Fibre Channel, Universal Serial Bus 4, JEDEC JESD247), and is the current Chair of the OIF Physical and Link Layer Working Group. Publications include “High Speed Serdes Devices and Applications”, Springer, 2008.

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