The Optical Networking and Communication
Conference & Exhibition

Moscone Center,
San Francisco, California, USA

CANCELLED - AIM Photonics Member Successes and Updates

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Theater III

Session organized by AIM Photonics

 

Session Description
AIM Photonics is in its fifth year of existence. In these past five years it has grown the Integrated Photonic Chip (PIC) ecosystem, established a world class 300mm PIC fab and packaging facility with best-in-class performance, and developed significant new technology in data comm, sensors, RF analog, design, and manufacturing technologies. Much of this success would not be possible without the support of AIM Photonics members and partners. In a first for AIM Photonics, a number of key members and partners will present their research and commercial successes to the public at the globally recognized OFC conference.
 


Presenters

Hansjoerg Haisch, Program Manager, Networks & Data Center Solutions, Keysight Technologies, Germany
Wafer-level Test Solutions Speeding Up The Advancements of Silicon Photonics

Comprehensive testing in research and design verification as well as for good known die selection in large volume production is key to speed up the advancements in Silicon Photonics and fully exploit the advantages of wafer scale integration of photonic functions. Keysight’s fully automated wafer and chip scale test solutions enable measurements at pure optical and DC level, RF characterization up to 110GHz and system level tests up to 120GBd.

David Harame, Chief Operations Officer and Director of EPDA, Test, Packaging, and Process Development, AIM Photonics, USA
AIM Photonics Fully Established 300mm Photonic Integrated Chip (PIC) Ecosystem Update; Process Design Kit (PDK), Multi Project Wafer (MPW), Test, Assembly, and Packaging (TAP)

Hear from the world’s leading Integrated Photonics Institute and learn how AIM’s manufacturing ecosystem has bridged the PIC development gap from design to final product.  See first-hand how AIM enables organizations of all sizes, to validate their next big PIC idea, and continues to set the standard for PIC technology design, fabrication, and final product implementation.

Satyavolu S. Papa Rao, Vice President for Research, NY CREATES, USA
Enabling Scalable Quantum Technologies

A quick introduction to “Quantum 2.0” will be followed by a short overview of the interconnected web of quantum technologies being explored today. The presentation will conclude with a discussion of ongoing R&D efforts at NY CREATES in this rapidly growing area.
 

Biographies

Hansjoerg Haisch, Program Manager, Networks & Data Center Solutions, Keysight Technologies, Germany

Dr. Hansjoerg Haisch is program manager for networks & data center solutions within Keysight Technologies’ communication solutions group. He has been responsible for definition and development of test and measurement products and solutions for photonic component and transmission test, lately for digital coherent transmission and integrated and Silicon photonics. Hansjoerg joined Agilent Technologies in 2001 as R&D project manager.  Hansjoerg started his career as R&D engineer for opto-electronic components in the Alcatel Research Center Germany in 1990, responsible for the design and characterization of opto-electronic components. Later he managed projects for high speed transmission, CaTV and fixed wireless networks in Alcatel research and product divisions. Hansjoerg holds a Ph.D. from Stuttgart University and a Master of Science from Oregon State University both in Electrical Engineering.

David Harame, Chief Operations Officer and Director of EPDA, Test, Packaging, and Process Development, AIM Photonics, USA

Dr. Harame is an IBM Fellow, an IEEE Fellow and a senior member of IEEE. He was the first to make SiGe devices using ultra high-vacuum chemical vapor deposition to deposit the SiGe layer and he was the leader of the development of the world's first successful silicon germanium (SiGe) technology generally available for analog and communications circuits used in wireless communications equipment, optical network interfaces,GPS and cellular telephones. The technologies he developed and later installed in IBM's Essex Junction, Vermont manufacturing facility in 1998, set records for the performance of silicon bipolar transistors and is still running in high volume today. Based on his work, SiGe HBTs now exceed frequencies of 390 GHz. This enables products based on existing compound semiconductor technology to be replaced with higher-performance, lower-power and lower-cost SiGe HBT technology commonly used in many products containing high-frequency analog circuits such as cell phones, WLAN, high-speed test and fiber optic applications. He received his education at Stanford University. He is the recipient of the 2010 IEEE BCTM Award and the 2004 IEEE Daniel E. Nobel Award for being the first SiGe Manufacturing Technology.

Satyavolu S. Papa Rao, Vice President for Research, NY CREATES, USA

Dr. Satyavolu ‘Pops’ Papa Rao obtained his Bachelor of Technology in Metallurgical Engineering from IIT-Madras, India, and his Ph.D. in Electronic Materials from MIT in 1996. He then joined Texas Instruments, working on process R&D for memory and logic devices. In 2007, he joined IBM Research, at Yorktown Heights, NY, working with teams that developed advanced CMP processes, Si solar cells with all-plated copper front-grid metallization, and nano-structures for DNA nucleotide recognition. In early 2014, Pops joined SEMATECH at Albany, as its Director of Process Technology. He is currently the VP for Research, NY CREATES, based at Albany. His efforts in developing quantum technologies are focused on the fabrication of high performance superconducting qubits using 300mm scale advanced processes, single-flux-quantum logic circuits, superconducting optoelectronics for neuromorphic computing, and AlN-based electrooptic integrated circuits, with partners across the United States.
 

Frank Tolic, Chief Marketing Officer, AIM Photonics, USA

Frank Tolic is the Chief Marketing Officer of AIM Photonics. As AIM’s CMO, Frank is responsible for development and execution of marketing strategies that expand the AIM brand, membership, technology, and services to the photonics community. He is also SUNY Polytechnic Institute’s Associate Vice President for Business, wafer processing, where he focuses on the creation of new business partnerships and is responsible for growing AIM Photonics and SUNY Poly’s core strategic technical and corporate partnerships. Prior to this assignment, he managed a portfolio of over one billion dollars in semiconductor business across the globe in support of semiconductor equipment, consumable, research, and manufacturing companies at Novati Technologies, SVTC, ATDF, and SEMATECH. Prior to his business role, Tolic was a Sr. Device Integration Engineer at Motorola’s Advanced Products Research and Development Laboratory, in Austin, TX. He received both Bachelors in Electrical Engineering and Mechanical Engineering from Lawrence Technological University, holds number of patents, and has published and presented various technical and business topics throughout his 30 years in in the semiconductor industry.

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