The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

112 Gbps Electrical Interfaces – An OIF Update on CEI-112G

Wednesday, 11 March, 16:15 - 17:00

Theater II

Session organized by OIF


Session Description
Electrical interfaces at 112 Gbps are a critical enabler of faster, more efficient and cost effective networks and data centers. A panel of OIF contributors will discuss the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable based solutions. The panel will provide an update on the multiple interfaces being defined by the OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables. Listen to thought leaders in the electrical interface industry debate the issues surrounding the CEI-112G projects and the architectures they will enable.

Nathan Tracy, President, OIF, USA



Ed Frlan, Senior System Architect, Semtech
Cathy Liu, Distinguished Engineer, Broadcom
Mike Li, Intel Fellow and High-Speed I/O and Interconnects Technologist, Intel Corporation
Gary Nicholl, Cisco
Steve Sekel, 400G/800G Solutions Specialist, Networking and Data Center, Keysight Technologies



Ed Frlan, Senior System Architect, Semtech, Canada

Ed Frlan is a Senior System Architect within the Signal Integrity Products Group of Semtech responsible for the definition of next generation 100G, 200G and 400G physical layer products. He is presently OIF’s Technical Committee Chair and is active in the development of several 112G electrical interface specifications. He joined Semtech from a Hardware Architect position within Ciena where he was responsible for the architecture and synchronization aspects of various line cards (including Carrier Ethernet, SONET/OTN and Broadcast Video). Ed holds a Ph.D. degree in Electrical Engineering from Carleton University.

Mike Li, Intel Fellow and High-Speed I/O and Interconnects Technologist, Intel Corporation

Dr. Peng (Mike) Li is an Intel Fellow and the technologist for high-speed I/O and interconnects at Intel Corporation. He serves as Intel’s technical expert and adviser in high-speed I/O and link technology; standards; SerDes architecture; electrical and optical signaling and interconnects; silicon photonics integration; optical field-programmable gate arrays (OFPGAs); and high-speed simulation, debug and test for jitter, noise, signaling and power integrity, from deign validation, to high-volume manufacturing (HVM).

Li joined Intel in 2015 with the acquisition of Altera Corp., where he had held a similar role since 2012. Before joining Altera in 2007, Li spent nearly a decade at Wavecrest Corp., culminating in his seven-year tenure as chief technology officer (CTO). He began his career in 1991 as a post-doctorate researcher at the Space Sciences Laboratory at the University of California, Berkeley.

A distinguished scientist and technologist, Li has contributed extensively to industry standards during his career, including PCI Express, Ethernet, Optical Internetworking Forum (OIF), Fibre Channel, and Serial ATA. He has also published widely, including >110 referred papers, >40 patents, five books and book chapters on jitter and high-speed architecture, testing, modeling, and analysis.

Li earned a bachelor’s degree in space physics from the University of Science and Technology of China in Hefei, China; a master’s degree in physics and a master’s degree in electrical and computer engineering, both from the University of Alabama in Huntsville (UAH); and a Ph.D. in physics, also from UAH. Li was named an IEEE Fellow in 2012, an Intel Fellow in 2015, and Engineer of the year in 2018 (Designcon). He has been elected as an affiliated professor at the Department of Electrical Engineering, University of Washington, Seattle, since 2010.

Cathy Liu, Distinguished Engineer, Broadcom, USA

Dr. Cathy Ye Liu, distinguished Engineer and director, currently heads up Broadcom SerDes architecture and modeling group. Previously she worked as R&D director and distinguished engineer in Avago/LSI which acquired Broadcom in 2016. Since 2002, she has been working on high speed transceiver solutions. Previously she has developed read channel and mobile digital TV receiver solutions. Her technical interests are signal processing, FEC, and modeling in high-speed optical and electrical transceiver solutions. She has published many journal and conference papers and holds 20+ US patents. Cathy has demonstrated her leadership roles in industry standard bodies and forums. Currently she serves as a member of the board director of Optical Internetworking Forum (OIF), a member of the board of advisors for the department of Electrical & Computer Engineering (ECE) of University of California at Davis and the co-chair of the DesignCon technical track of high speed signal processing, equalization and coding.

Gary Nicholl, Cisco




Steve Sekel, 400G/800G Solutions Specialist, Networking and Data Center, Keysight Technologies

Steve Sekel is currently the 400G/800G solutions specialist in the Internet Infrastructure team within the Networking and Data Center division at Keysight Technologies. In this role, he guides the requirements definition for solutions and solution components used for characterization and compliance testing of everything within the data center ecosystem involving '400G class' optical and electrical links. Steve currently represents Keysight in the CEI (Common Electrical Interface) project working groups within the Optical Internetworking Forum as well as the 802.3ck 100Gbps/lane high speed Ethernet task force. In the past he has made similar contributions within the 32G and 64G Fibre Channel physical layer standard working group. In OIF Steve also chairs the Physical and Link Layer Interoperability working group.

Nathan Tracy, President, OIF, USA

Nathan Tracy currently serves as OIF’s president and member of the board of directors. During the past nine years he has also served OIF as VP of marketing, technical committee chair and technical committee vice chair. As a technologist on the system architecture team and manager of industry standards for the Data and Devices business unit at TE Connectivity (TE), Nathan is responsible for driving standards activities and working with key customers to enable new system architectures. Nathan has more than 30 years of experience in technology development, marketing and business development for TE in areas including RF/microwave, and high-speed signaling technology for the networking, telecom, wireless, automotive and defense markets. 

 Nathan is also an active member of other industry standards and associations. Currently he serves the Ethernet Alliance as a member of the board, and he is a regular attendee and contributor to IEEE 802.3 and COBO. Additionally, he is active in a number of industry MSAs and forums where he has held leadership roles. Nathan earned his Bachelor of Science Electrical Engineering Technology degree from the University of Massachusetts, Dartmouth.

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