Expo Theater I
Continuous growth of data center performance and high performance computing requires wider bandwidth optical interconnects. Considering the signal loss on the PCB, the wider bandwidth optical interfaces need to get closer to the processors using innovative approaches such as on-board optics or in-package optics. This will require innovative photonic integration technology as well as packaging technology and will drastically impact the photonics devices ecosystem.
The panel will debate the current reality and the future promise of packaging technology, photonic integration and the associated eco systems.