The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Panel V: Inside the Data Center

Thursday, 12 March
10:30 - 12:00
Expo Theater I

Moderator: Hideki Isono, Senior Professional Engineer, Fujitsu Optical Components, Japan

Panel Description:

Global Datacenter IP traffic, growing rapidly at a 25 percent year over year growth rate, is to become 20 Zettabytes in 2021, according to Cisco Global Cloud Index 2018. To meet this huge capacity demand, high speed network systems are being deployed with optics operating at 100Gbit/s and beyond.  

The IEEE802.3 has completed new Ethernet standards for rates up to 400Gbit/s (802.3bs/cd) in 2018 adopting 25GBaud PAM4 50Gbit/s optical modulation (8x50G). They have also recently introduced the 50GBaud PAM4 100Gbit/s optical modulation format as new Ethernet technology building blocks for 8x50G and 4x100G 400GE optical interfaces. As for electrical interfaces, 50Gbit/s per lane 400GE has already matured (8x50G) and 100Gbit/s per lane for 4x100G is being discussed. 

Along with these developments, new pluggable form factor MSAs such as QSFP-DD and OSFP have been commercialized and matured. As a result, maximum system board-level data throughputs have reached as high as 14.4Tbit/s. 

The next phase of the datacenter technology roadmap (beyond 400G) remains somewhat unclear. Solutions for 800G and 1.6T can be expected; however, it will take several years for technologies for 100Gbit/s electrical and optical lane rates to achieve desirable power consumption and density targets.  If industry sticks to pluggable solutions, we will see parallel solutions such as dual- or quad- 400G pluggable modules. This will require drastic improvements in integration technologies (see the optical integration focused panel at this OFC) and improvements in CMOS processes below 7nm to restrain increases in power consumption density. An alternative direction would be on-board optics and co-packaging, which may need new technology breakthroughs and more time to mature. 

This panel will introduce the views of several industry leaders in this area and evoke discussion among panelists and the floor. 

Speakers:

Andreas Bechtolsheim, Chairman and Chief Development Officer, Arista Networks, USA
The Road to 800G

As the demand for more bandwidth in the cloud keeps growing, the most cost-effective solution for data center switching and optics vendors is to embrace the 100G SERDES ecosystem and 800G optics. In my presentation, I will discuss the status of 800G data center optics and system developments together with some innovations that will facilitate the adoption of these 800G optics in existing data centers.


Robert Blum, Director of Marketing and New Business, Intel, USA
Integrated Silicon Photonics for High-volume Data Center Applications

The rapid growth in data center traffic has been the key driver for the increased performance of networking equipment, such as Ethernet switches and optical pluggable transceivers. But bandwidth scalability challenges around density, cost, and power will require much tighter integration of optics and networking silicon in the near future. We will discuss how silicon photonics combined with advanced packaging approaches can enable higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.


Brad Booth, Principal Hardware Manager, Next Cloud System Architecture, Microsoft, USA
Network Diversity

Machine learning, artificial intelligence, front end network, backend network, edge, core, DCI, etc. Equipment and transceiver manufacturers look to find commonality to develop products for market volume, but the list is long on what drives differentiation. Is there commonality to be found or will diversity persist?


Jeffery Maki, Distinguished Engineer II, Juniper Networks, USA
Bandwidth Density Progression

Bandwidth evolution of routing and switching systems have converged at 12.8 to 14.4 Tb/s capacity per 1RU with adoption of 400 Gb/s Ethernet in a common form factor. There are competing points of view about how to facilitate higher bandwidth density. The presenter will review factors that influence the evolution and choice of implementation.


Mark Nowell, Fellow, Cisco, USA
400 GbE Hits the Mainstream Inside the Data Center

With years of development and anticipation leading up to the availability of 400 GbE, deployments are now in progress.  This talk will focus on how the industry focus on key technology building blocks will lead 400 GbE to be broadly deployed and then lead to what comes next.


Sang-Yoon (Sy) Rhee, Marketing Director, COO, Fujitsu Optical Components America, Inc. (FOCUS), USA
Technology Options for Next-Gen Data Center Optics

This presentation discusses the challenges and solutions towards the development of optical modules that are required for high speed connectivity inside the data center.  Recent progress in module configuration, transmission schemes, DSP, thermal management are reviewed and their future prospects are discussed.


Biographies:

Andreas Bechtolsheim, Chairman and Chief Development Officer, Arista Networks, USA

Andreas “Andy” Bechtolsheim is Chairman, Chief Development Officer and Co-Founder of Arista Networks, a leading vendor of cloud networking solutions. Previously, Andy was a Co-Founder and Chief System Architect at Sun Microsystems, responsible for next generation server, storage, and network architectures. As a private venture investor, Andy has been involved in the funding of numerous companies including Google, VMware, Mellanox, and Brocade. He has served on the Board of Directors of over 25 companies, the majority of which went public or were acquired. Andy earned a M.S. in Computer Engineering from Carnegie Mellon University in 1976. He was a doctoral student in Computer Engineering at Stanford University from 1977 to 1982. He has been honored with a Fulbright scholarship, a Studienstiftung scholarship, the Stanford Entrepreneur Company of the year award, the Smithsonian Leadership Award for Innovation, and he is a member of the National Academy of Engineering.
 

Robert Blum, Director of Marketing and New Business, Intel, USA

Robert Blum is Director of Marketing and New Business for Intel’s Silicon Photonics Product Division. Prior to joining Intel, Robert was Director of Strategic Marketing at Oclaro Inc., and held various Director of Product Management and Marketing roles for Oclaro’s telecommunications products and consumer laser portfolio. Before joining Oclaro, Robert was Product Line Manager for optical transmission components at JDS Uniphase Corporation and held various engineering and marketing management roles at Gemfire Corporation, all in California. Robert worked at Deutsche Telekom’s research labs in Darmstadt, Germany, while completing his master’s thesis and holds a doctorate degree in Physics from the University of Technology in Hamburg. He has also studied and done research at Ecole Polytechnique Fédérale in Lausanne, Switzerland, and at Stanford University, California.
 

Brad Booth, Principal Hardware Manager, Next Cloud System Architecture, Microsoft, USA

Brad Booth is a distinguished leader in technology development and standardization. He is the Director for Networking and Connectivity in Microsoft’s Next Cloud System Architecture Group where he leads a team responsible for the development of next generation solutions for Microsoft’s cloud and AI datacenters. Previously, Brad has held technology strategist and engineering positions at Dell, Intel and Bell-Northern Research. The holder of over 20 patents related to networking technologies, he has also received awards for his contributions to industry consortia and IEEE 802.3 Ethernet standards.


Hideki Isono, Senior Professional Engineer, Fujitsu Optical Components, Japan

Mr. Hideki Isono has been involved in the broad range of major R & D projects in Fujitsu such as passive/active optical components and optical transceivers for over 35years. His current job includes global standardization such as OIF/ IEEE 802.3 and IEC.He received IEC 1906 award in 2013 and now a convenor of SC86C WG4.



 

Jeffery Maki, Distinguished Engineer II, Juniper Networks, USA

Dr. Jeffery Maki works on cloud optics. He is a member of the board of directors of the Ethernet Alliance and an IEEE 802.3 Ethernet voter. For OIF, he is PLUG chair and technical voter for Juniper Networks. He is co-chair of the 100G Lambda MSA and a founding member of the QSFP-DD800, QSFP-DD, SFP-DD and Open-Eye MSAs. For COBO, he is a member of the board of directors, VP and Data Center Networking working group chair. He is an OSA and IEEE member. He has a Ph.D. in Optics from The Institute of Optics, University of Rochester, Rochester, New York.
 

Mark Nowell, Fellow, Cisco, Canada
Mark Nowell is a Cisco Fellow in Cisco’s Data Center Business Unit. His focus is on next generation interconnect technology innovation to meet Cisco's needs. Mark is also active within the industry standards and forums and has chaired multiple IEEE 802.3 Ethernet projects. He represents Cisco on various industry alliances and Consortium.  Mark also chairs a number of industry MSA (Multi-source Agreement) groups focusing on next generation optical module form factors (QSFP-DD, QSFP-DD800) and optical interface signaling technology (100G Lambda MSA, 400G BiDi).
 

Sang-Yoon (Sy) Rhee, Marketing Director, COO, Fujitsu Optical Components America, Inc. (FOCUS), USA
Sy Rhee is Marketing Director/COO of Fujitsu Optical Components America (FOCUS), a subsidiary of Fujitsu Optical Components, Ltd (FOC). He has over 20 years of experience in the fiber optics industry specializing in high-speed 100G and beyond optoelectronic components for data and tele-communication applications. Since joining FOC in 2005, he has worked in application engineering, product planning, and marketing roles covering every segment of FOC products. Prior to FOC, Sy held various product development positions at Fujitsu Compound Semiconductor and NeoPhotonics. Sy received his Ph.D. from The Ohio State University in Mechanical Engineering.

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