Enhancement of RF Performance of 128-Gbaud Lumped EML Submodule Utilizing LC Resonance With Capacitive Wire-Bonding Pad (W2A.2)
Presenter: Seokjun Yun, Electronics and Telecommunications Research Institute
We report on a high-bandwidth (>67 GHz) lumped EML submodule obtained by utilizing an LC resonance effect in conjunction with a capacitive wire-bonding pad for enhanced RF performances, enabling 128-Gbaud PAM-4 and PAM-6 operations experimentally.
Authors:Seokjun Yun, Electronics and Telecommunications Research Institute / Young-Tak Han, Electronics and Telecommunications Research Institute / Dong-Hoon Lee, Electronics and Telecommunications Research Institute / Dong-Hyo Lee, Electronics and Telecommunications Research Institute / Seo-Young Lee, Electronics and Telecommunications Research Institute / Young-Kyu Choi, Electronics and Telecommunications Research Institute / Jang-Uk Shin, Electronics and Telecommunications Research Institute / Sang-Ho Park, Electronics and Telecommunications Research Institute / Hoon Kim, Korea Advanced Institute of Science and Technology / Yongsoon Baek, Electronics and Telecommunications Research Institute