Daniel Blumenthal, Univ. of California, Santa Barbara, USA; Benjamin Eggleton, Univ. of Sydney, Australia; Leif Oxenløwe, DTU, Denmark
New integration technologies are on the horizon for communications, signal processing and sensing applications, opening up new possibilities for functions and systems on-chip with lower energy, higher performance and increased density. Silicon photonics in tandem with other legacy technologies is quickly becoming the de facto-standard for a large portion of research and commercialization. However, limitations of silicon photonics raise the issue if it is a ubiquitous solution, and what other new photonics and device integration technologies can offer for future applications and capabilities.
The workshop will discuss the requirements of future applications and subsystems, how they can be met by traditional silicon photonics, what the limits are with this solution, and what new photonic technologies emerging on the horizon can meet these future requirements:
What are the integration and performance requirements of tomorrow’s high capacity and low power, low cost communications and sensor subsystems?
What is the end-user perspective on silicon photonics and adoption of new technology solutions?
How are subsystem and user requirements helped and hampered by the performance, scalability, and functional and physical limitations of silicon photonics?
What are the opportunities for improvements in power dissipation, power handling capabilities, embedded gain, footprint, performance and functionality?
What are the emerging applications?
What are the next generation photonic technologies being developed that can address this space?
Examples include photonic molecules, photon-phonon and optomechanic based devices, quantum photonic integrated circuits, strong broadband non-linear optics, topological photonics, chiral photonics, and nanophotonics.
What new applications can be enabled by these technologies?
Examples include dispersion engineering, chip scale RF processors, optical acoustic signal processing, nonlinear optical functions, unidirectional lasers, quantum communications and computing on chip, ultra-fast and large-scale optical logic, ultra-low energy optical switches, frequency comb devices, magnet-free optical isolation, ultra-low energy devices for large-scale integration, ultra-fast chips to handle terabit communications in small form factors, sensors for position and navigation, optical signal processing functions for digital and RF communications.
Part I: End User Perspective
Opportunities for Next Generation Integrated Photonics
Katharine Schmidtke, Facebook, USA
Special Purpose High Performance Computational Chips
Thomas Van-Vaerenbergh, HPE, Belgium
The Current State of Silicon Photonics and What are the Limits
Daoxin Dai, Zhejiang Univ., China
Part II: Next Generation Device Physics
Brillouin Scattering and Photon-phonon Signal Processing in Silcon
Peter Rakich, Yale University, USA
Silicon Rich Nitrades
Dawn Tan, Singapore Design University of Technology, Singapore
Flexible Silicon Solutions
Anna Peacock, Univ. of Southampton, United Kingdom
Juerg Leuthold, ETH Zurich, Switzerland
Part III: Next Generation Devices and Funtions
Integrated Photonics Beyond Silicon
Roel Baets, Ghent Univ., Belgium
Integrated Photonics for Positional Navigation and Sensing (Optical Gyros)
Matthew Puckett, Honeywell, USA
Integrated Photonics for Microwave Photonics
David Marpaung, University of Sydney, Australia
Functions for Photonic Molecules and Quantum Annealing
Guha Saikat, University of Arizona, USA