Special Symposia

Beyond The Gold Box: The Future of Integrated Optics

Enabling The Cloud: Unleashing the Capabilities of Emerging Flexible Optical Transport through SDN and NFV

Future of Broadband Access

Beyond The Gold Box: The Future of Integrated Optics

Organizers: Christopher Cole; Finisar Corporation, USA; Robert Lingle; OFS, USA; Chris Fludger; Cisco Optical GmbH, Germany; Clint Schow; IBM T.J. Watson Res. Ctr., USA

The on-going explosion of data and the need to move and process it efficiently demands ever greater amounts of optical I/O at every level.  A special symposium at OFC 2015 will focus on how packaging and integration may be used to lower cost for different applications in the network.  A consistent theme will be a focus on optimizing the integration of optics and electronics as a path to dramatically reduce the cost of traditional “gold box” optical modules.  This symposium tackles the topic of packaging and integration technologies, targeting high capacity optical transport for line-side, client-side and inter- and intra- data centre applications.

A dynamic line up of invited speakers will illustrate the challenges and propose solutions to achieve the next generation of optimized optical interfaces.

Plan on attending and being a part of this exciting new field at OFC 2015!

Part I: Line-side Techniques to Move Beyond the Gold-Box

Line-side applications are also demanding integrated pluggable optics as a means of thermal separation of "hot" ASICs and sensitive optical components with the added benefit of adding and replacing optical interfaces on-demand.  Whilst long-haul traditionally demands the highest levels of performance, Metro DWDM applications have a greater emphasis on cost. Which packaging and device technologies are suitable for line-side applications (e.g. InP, SiP) and how can DSP be used to facilitate their use?

Introduction: Chris Fludger; Cisco Optical GmbH, Germany

Beyond CFP2 ACO, Ian Betty; Ciena, USA.

  • Where is CFP2-ACO now? Where is it going?

  • Pluggable optics vs board mounted components

  • How do we integrate smaller?

  • Main cost / thermal contributors

  • Techniques to separate Hot DSP and sensitive Optics

  • How to reduce the cost further?

Device Technologies for Integrated Packaged Transceivers, Robert Griffin; Oclaro, Inc., USA

  • Packaging techniques for beyond CFP2-ACO, for 100G,400G

  • Transmitter/ Receiver technology (InP, SiP, Polymer) overview and what is next?

    • Combined Lasers and Modulators

    • Integrated receiver components.

  • Integrated DSP vs external DSP

  • Thermal and packaging challenges

Analogue Interfaces for Pluggable Optics, Thomas Duthel; Cisco Systems, Inc. USA

  • Packaging technologies for high speed analogue interfaces

  • Limits of high bandwidth interfaces

  • DSP compensation of transmission lines & components

  • Comparisons of photonic integration InP vs SiP for 100/200/400G

  • DSP compensation of technology impairments (e.g. InP)

  • Transmission results

Integrated Devices for Metro Applications, Michael Eiselt; ADVA Optical Networking AG, Germany

  • Pluggables vs on-board optics in a metro environment ?

  • Packaging and integration techniques for Metro line-cards

    • Thermal aspects

    • Cost aspects

    • Size aspects

  • DSP for metro modulation formats to enable dense low cost DWDM interfaces

    • Coherent interfaces vs direct-detection (DMT etc)

    • DSP for compensation of low-cost optics

  • Integration platforms : InP / SiP for Metro modulation formats

    • Applicability for >100G.

Integrated Devices for Metro Applications, Merhdad Ziari; Infinera Corporation, USA

  • Integration technologies : InP, SiP for lower cost.

  • Integration and packaging for line-side applications

  • Aspects that must be controlled at manufacture

  • Aspects that can be corrected by DSP

  • Pluggable devices vs linecard integrated devices.

  • Packaging techniques for Metro line-cards

  • DSP formats to enable dense low cost interfaces.

  • Physical and Thermal aspects of high integration

Future Narrow Linewidth Lasers, Toshikazu Mukaihara; Furukawa Electric Co., Japan

  • Packaging and integration of small form factor narrow linewidth iTLAs

  • Operating principles

  • Challenges with thermal design

  • Is cooling essential for long-haul / metro

  • Technology trends, and future technologies for 400G/1T transmission systems and CFP2-ACO and beyond

Part II:  Data Center Optical Techniques to Move Beyond the Gold-Box

Within data center servers, will the next generations of optics move from the backplane to be embedded close to chip modules or even all the way onto chip packages?  How should next-generation optical devices be developed to address density and thermal challenges that will arise as integration levels increase? Integrated pluggable optical interfaces have been used extensively in client applications. Enabling technologies and modulation techniques for client-side applications will be discussed with the target of deploying cost-effective links of up to 2‑km through component and packaging reduction.

Introduction: Clint Schow; IBM T.J. Watson Res. Ctr., USA

How Do You Do The Laser?, Yuliya Akulova; JDSU, USA

  • Monolithic vs Hybrid Integration

  • Decent lasers without cooling ?

    • Techniques for stabilising wavelength and power

  • Packaging techniques ?

  • InP

How Do You Do The Laser?, Greg Fish; Aurrion, USA; Alfredo Viglienzoni; Skorpios, Inc., USA

  • Focus on Optical monolithic

  • Circuit monolithic (only Luxtera and perhaps no longer)

  • No cooling

How Do You Get Off The Chip Into The Fiber?, Tymon Barcwicz; IBM Research, USA

  • Technologies for  higher integration and the challenges of light coupling

  • How do we couple a bigger number of fibres to an integrated chips whilst maintaining low cost?

How Do You Get Off The Chip Into The Fiber?, Bardia Pezeshki; Kaiam, USA

  • Technologies for  higher integration and the challenges of light coupling

  • How do we couple a bigger number of fibres to an integrated chips whilst maintaining low cost?

Part III: Data Center Circuits and DSP Techniques to Move Beyond the Gold-Box

Introduction: Christopher Cole; Finisar Corporation, USA

Low Power Circuits, Thelingh Nguyen; Finisar Corporation, USA;

  • Integration of low power circuits and photonics

  • Low power modulators/drivers

  • Low Vpi modulators

  • Low optical loss modulators

  • Integration of drivers

  • Quad drivers

  • Thermal stability

DSP to Reduce Package Size, Vipul Bhat; Inphi, USA

  • What is limiting the integration density of 100G client transceivers ?

  • Requirements for data-centre /campus interconnects

  • Does separation of DSP and optics give denser interfaces for client-applications ?

    • Is this a path to lower cost ? One DSP servicing multiple simple optical modules.

  • What do the coding options do for the optics ? How do you replace optical components with signal processing ?

  • Practical aspects of deployed systems - RIN / reflections/ noise / low-cost optics

  • Not just a modulation format comparison.

DMT Reducing Package Cost, Tomoo Takahara; Fujitsu, Japan

  • How does DMT enable 100G single wavelength?

  • How is the solution packageable / manufacturable?

    • How does the DSP support this?

  • Performance of DMT

  • Main impairments / limitations

  • Integration and packaging techniques

  • Power dissipation & budget

56Gbaud PAM-4 Reducing Packaging Cost, Edward Frlan, Semtech, USA

  • How does 56G-PAM-4 enable 100G single wavelength?

  • How is the solution packageable / manufacturable?

  • How can packaging and integration support 56Gbaud line-rates?

    • What DSP is required for this?

    • Is it Gold Box? (wasn't that a Gold box I saw?)

  • Performance?

  • Main impairments / limitations

  • Integration and packaging techniques

  • Power dissipation & budget

Enabling The Cloud: Unleashing the Capabilities of Emerging Flexible Optical Transport through SDN and NFV

Organizers: Clint Schow; IBM T.J. Watson Res. Ctr., USA; Dimitra Simeonidou; University of Bristol, UK; Marina Thottan; Alcatel-Lucent Bell Labs, USA

Software Defined Networking (SDN) is becoming an established trend in operation and management of today’s networks from Data Centre (DC) to Telecomm Infrastructures. Network Functions Virtualisation (NFV) is another emerging trend that has been recently introduced to reinforce the evolution of network services. Enabling SDN and NFV to support optical networks can provide a new open framework that can potentially facilitate network virtualisation, application specific network slicing at the optical layer as well as coordination and orchestration of higher layers and applications with the optical layer.
 
In parallel with the two aforementioned trends, programmable network technologies  are rapidly emerging, which can utilise plugable photonics and electronics and synthesise on demand hardware platforms . These new technology capabilities will provide a framework for hosting various network functions at the transport layer and if combined with SDN and NFV can create a very unique and attractive solution that allows full application programmability of the optical networks.
                 
This symposium will attempt to shed light on potentials and benefits of combined SDN, NFV and programmable hardware as the basis of an emerging framework for optical infrastructure evolution for telecommunication  and cloud service providers. It brings together leading experts from industry and research to discuss solutions for extending SDN and NFV frameworks, protocols and new functions in optical data plane technologies such as programmability within context of data center, metro and core networks.

Future of Broadband Access

Part I “Future of Broadband Access: Trends and Drivers”
Part II “Future of Broadband Access: Technologies”

Organizers: Neda Cvijetic; NEC Laboratories America, USA; Junichi Kani; NTT Access Service Systems Laboratories, Japan; Peter Vetter; Alcatel-Lucent, USA; Antonio Teixeira, Aveiro University, Portugal

This symposium will examine the trends and technologies poised to shape the future of broadband access. Key drivers, including 5G mobile, Internet of Things (IoT), and universal/unlimited access initiatives, as well as their potential ramifications on future broadband access will be discussed. From the technology perspective, presentations will delve into the competing options for the access segment, including a summary of the latest advances in fiber, copper, and wireless technologies. Important operational aspects affecting access networks will also be examined.

Topics to be discussed include:

  • Application Drivers and Trends for Future Broadband Access

  • The State of FTTx: Technologies and Trade-Offs

  • Cable at the Speed of Optical Access

  • G.fast: Copper Stays in the Broadband Access Game

  • Broadband Wireless Access: 5G, IoT, and Beyond

  • Operational Issues in Access Networks: Past, Present, and Future

  • Unlimited Access: Anyone, Anywhere, Anytime, Any Speed, for Anything

  • Net Neutrality and Broadband Access: What Does the Future Hold?