Organizers: Christopher Cole; Finisar Corporation, USA; Robert Lingle; OFS, USA; Chris Fludger; Cisco Optical GmbH, Germany; Clint Schow; IBM T.J. Watson Res. Ctr., USA
The on-going explosion of data and the need to move and process it efficiently demands ever greater amounts of optical I/O at every level. A special symposium at OFC 2015 will focus on how packaging and integration may be used to lower cost for different applications in the network. A consistent theme will be a focus on optimizing the integration of optics and electronics as a path to dramatically reduce the cost of traditional “gold box” optical modules. This symposium tackles the topic of packaging and integration technologies, targeting high capacity optical transport for line-side, client-side and inter- and intra- data centre applications.
A dynamic line up of invited speakers will illustrate the challenges and propose solutions to achieve the next generation of optimized optical interfaces.
Plan on attending and being a part of this exciting new field at OFC 2015!
Part I: Line-side Techniques to Move Beyond the Gold-Box
Line-side applications are also demanding integrated pluggable optics as a means of thermal separation of "hot" ASICs and sensitive optical components with the added benefit of adding and replacing optical interfaces on-demand. Whilst long-haul traditionally demands the highest levels of performance, Metro DWDM applications have a greater emphasis on cost. Which packaging and device technologies are suitable for line-side applications (e.g. InP, SiP) and how can DSP be used to facilitate their use?
Presider: Chris Fludger; Cisco Optical GmbH, Germany
Beyond CFP2 ACO, Ian Betty; Ciena, USA.
Device Technologies for Integrated Packaged Transceivers, Robert Griffin; Oclaro, Inc., USA
Impact of Pluggable Analog Coherent Optics Modules on Line Card Architecture and DSP Functionality, Thomas Duthel; Cisco Systems, Inc. USA
Integrated Devices for Metro Applications, Michael Eiselt; ADVA Optical Networking AG, Germany
Integrated Devices for High-Performance Optical Links, Merhdad Ziari; Infinera Corporation, USA
Future Narrow Linewidth Lasers, Toshikazu Mukaihara; Furukawa Electric Co., Japan
Part II: Data Center Optical Techniques to Move Beyond the Gold-Box
Within data center servers, will the next generations of optics move from the backplane to be embedded close to chip modules or even all the way onto chip packages? How should next-generation optical devices be developed to address density and thermal challenges that will arise as integration levels increase? Integrated pluggable optical interfaces have been used extensively in client applications. Enabling technologies and modulation techniques for client-side applications will be discussed with the target of deploying cost-effective links of up to 2‑km through component and packaging reduction.
Presider: Clint Schow; IBM T.J. Watson Res. Ctr., USA
InP Photonic Integrated Circuits for High Efficiency Pluggable Optical Interfaces, Yuliya Akulova; JDSU, USA
High Bandwidth Transceivers Using Heterogeneous Integration on Silicon, Greg Fish; Aurrion Inc, USA
Silicon Photonics … With The Photons, Alfredo Viglienzoni; Skorpios, Inc., USA
Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability, Tymon Barcwicz; IBM Research, USA
Embracing Diversity – Interconnecting Different Materials and Components for the Lowest $/Gb, Bardia Pezeshki; Kaiam, USA
Part III: Data Center Circuits and DSP Techniques to Move Beyond the Gold-Box
Presider: Christopher Cole; Finisar Corporation, USA
Circuit Design Techniques For High Bit Rate and High Density Optical Interconnects, The'Linh Nguyen; Finisar Corporation, USA
Low Power Circuits, Haoli Qian; Credo Semiconductor, USA
Low-Power MOS-Capacitor Based Silicon Photonic Modulators and CMOS Drivers, Mark Webster; Cisco Systems, Inc., USA
Deploying DSP in Optical Transceiver Modules, Vipul Bhatt; Inphi, USA
Can Discrete Multi-Tone Reduce the Cost for Short Reach Systems?, Tomoo Takahara; Fujitsu Laboratories Ltd., Japan
Investigation of 50 GBd PAM-4 Electrical Interfaces for 2km Data Center Interconnects, Edward Frlan, Semtech, USA
Organizers: Clint Schow; IBM T.J. Watson Res. Ctr., USA; Dimitra Simeonidou; University of Bristol, UK; Marina Thottan; Alcatel-Lucent Bell Labs, USA
Software Defined Networking (SDN) is becoming an established trend in operation and management of today’s networks from Data Centre (DC) to Telecomm Infrastructures. Network Functions Virtualisation (NFV) is another emerging trend that has been recently introduced to reinforce the evolution of network services. Enabling SDN and NFV to support optical networks can provide a new open framework that can potentially facilitate network virtualisation, application specific network slicing at the optical layer as well as coordination and orchestration of higher layers and applications with the optical layer.
In parallel with the two aforementioned trends, programmable network technologies are rapidly emerging, which can utilise plugable photonics and electronics and synthesise on demand hardware platforms . These new technology capabilities will provide a framework for hosting various network functions at the transport layer and if combined with SDN and NFV can create a very unique and attractive solution that allows full application programmability of the optical networks.
This symposium will attempt to shed light on potentials and benefits of combined SDN, NFV and programmable hardware as the basis of an emerging framework for optical infrastructure evolution for telecommunication and cloud service providers. It brings together leading experts from industry and research to discuss solutions for extending SDN and NFV frameworks, protocols and new functions in optical data plane technologies such as programmability within context of data center, metro and core networks.
Part I Speakers:
ONF Current Activity and Views on Transport SDN, Dan Pitt; ONF, Australia
Mehran Estandiari; AT&T, USA
Architecting the Next Generation DCN for Flexibility and Scale with Optics and SDN, Katherine Barabash; IBM, Israel
Towards a Common Network Orchestration Protocol for Multi-tenant Multi-domain Optical Networks with Heterogeneous Control and Data Planes Technologies, Raul Munoz; CTTC, Spain
Part II Speakers:
Yuval Bachar; Facebook, USA
Daniel Dreps; IBM, USA
Gordon Brebner; Xilinx Inc., USA
Jeff Cox; Microsoft, USA
Organizers: Neda Cvijetic; NEC Laboratories America, USA; Junichi Kani; NTT Access Service Systems Laboratories, Japan; Peter Vetter; Alcatel-Lucent, USA; Antonio Teixeira, Aveiro University, Portugal
This symposium will examine the trends and technologies poised to shape the future of broadband access. Key drivers, including 5G mobile, Internet of Things (IoT), and universal/unlimited access initiatives, as well as their potential ramifications on future broadband access will be discussed. From the technology perspective, presentations will delve into the competing options for the access segment, including a summary of the latest advances in fiber, copper, and wireless technologies. Important operational aspects affecting access networks will also be examined.
Part I: Future of Broadband Access: Trends and Drivers
Application Drivers and Trends for Future Broadband Access, Tomoaki Yoshida; NTT Corporation, Japan
Internet Connectivity for the World's 60% Unconnected Population, Hamid Hemmati; Facebook Inc., USA
Operational Issues in Access Networks: Past, Present, and Future, David Payne; CTVR Trinity College Dublin, Ireland
FTTx Migration Challenges to Giga-bps Hyper-connectivity Networking Infrastructure, Bongtae Kim; Electronics & Telecom Rsrch Inst., South Korea
Part II: Future of Broadband Access: Technologies
DOCSIS 3.1® Technology and Hybrid Fiber Coax for Multi-Gbps Broadband, Dan Rice; CableLabs, USA
Copper is the New Black for Ultra Broadband Networks, David Eckard; Alcatel-Lucent Bell Labs, USA
Broadband Wireless Access: 5G, IoT, and Beyond, To Be Determined
Net Neutrality and Broadband Access: What Does the Future Hold?, To Be Determined