The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Foxconn Interconnect Technology, Ltd. to Showcase QSFP-DD Solutions at OFC 2017

MEDIA ADVISORY

20 March 2017

Contact:
Tony Campbell
tony.campbell@foit-foxconn.com

Foxconn Interconnect Technology, Ltd. to Showcase QSFP-DD Solutions at OFC 2017

SAN JOSE, CA, -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of interconnect solutions and a founder-promoter of the QSFP-DD MSA, will showcase its latest QSFP-DD solutions in featured product and technology demonstrations at the Optical Fiber Communications (OFC) Conference & Exhibition, to be held March 21-23, 2017, at the Los Angeles, CA Convention Center.
 
The live traffic demonstrations will incorporate a selection of FIT’s rapidly expanding QSFP-DD product portfolio that currently includes various configurations of cages, connectors and cables that combine to deliver 200 Gbps and 400 Gbps solutions.
 
Conference attendees are invited to visit FIT at booth #2666 in the OFC corporate village at the Los Angeles Convention Center where the QSFP-DD products and demonstrations will be on display. 
  • QSFP-DD products: FIT will be showcasing its growing line of QSFP-DD cage, connector and interconnect products.
  • QSFP-DD product and technology demonstrations: Live traffic up to 400 Gbps will be run over interconnects utilizing FIT QSFP-DD cables, cages and connectors. 
FIT products will also be on display in the QSFP-DD demo in the Ethernet Alliance booth #3709 and in the MultiLane booth #2133.
 
“As a founder-promoter of the QSFP-DD MSA, FIT is committed to the development of 50G, 200G and 400G products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, direct attach copper (DAC), and active optical cables (AOC) on the market. The QSFP-DD product and technology showcases that will take place at this year’s OFC demonstrate both our commitment to the MSA and our position as a market and technology leader,” said Steve Shultis, Director of Product Marketing at Foxconn Interconnect Technology.
 
Availability
FIT is currently sampling various configurations of QSFP-DD cages, connectors and cables and is actively developing many more. Please contact your local FIT sales representative for samples and pricing.
 
Additional FIT solutions to be showcased at booth #2666 include: 
  • 100G Ethernet PAM-4 VCSEL Based Multimode QSFP28 Transceiver
  • 100G Ethernet QSFP28 4WDM Optical Transceiver
  • 100G Ethernet QSFP28 eSR4 Transceivers with 300m Extended Reach
  • 12x25 Gb/s per Lane CXP2 Transceiver
About Foxconn Interconnect Technology 
FIT is headquartered in Taipei, Taiwan and has over 70,000 employees worldwide. FIT is led by CEO Sidney Lu, and is ranked among the top interconnect companies worldwide by revenue.  For more information regarding FIT, please see:  http://www.fit-foxconn.com.

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