TE Connectivity Showcases Networking Solutions to Enable Terabit Speeds at OFC/NFOEC 2013
ANAHEIM, CA. – March 14, 2013 – TE Connectivity will be a key exhibitor at the upcoming Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC / NFOEC), taking place March 17-21, 2013 at the Anaheim Convention Center in California. TE will present live demonstrations showcasing connectivity solutions that enable terabit networks, including 4 x 25Gb/s optics. Details include:
Data Communications will preview its new line of 25 Gb/s high-speed optical transceivers, connectors and cables, demonstrating how networking equipment architectures can perform at terabit speeds. The division will also display and demonstrate its latest STRADA Whisper 25 Gb/s backplane connector for architectures that leverage copper-based connectivity.
Telecom Networks will unveil its new line of NG4access value-added modules (VAMs), which offers easy integration of optical components into the network for increasing fiber capacity, troubleshooting or distributing signals to multiple subscribers.
Aerospace, Defense, Marine (ADM) will showcase its new line of ruggedized fiber optics connectors used in military and defense equipment, which brings the benefits of optical technology to the challenging environments of defense and aerospace applications.
TE will also participate in the following presentation sessions:
For more information on the TE booth #2327 at OFC/NFOEC 2013, visit our special events web page: http://www.te.com/en/tradeshows/2013/ofc-2013.html
Overview of the OIF Next Generation Interconnect Framework Document, TE Marketing Manager and OIF Technical Committee Vice Chair Nathan Tracy and TE Director of Optics Engineering will participate in a discussion reviewing the Optical Internetworking Forum (OIF) Next Generation Interconnect Framework document. The focus of the panel will be to identify the types of interconnects and technology needed for the next generation of speed and bandwidth. This discussion will take place in the Expo Theatre II on Tuesday, March 19, at 11:00 a.m.
25.78 Gbps Data Transmission with 850nm Multimode VCSEL Packaged in QSFP Form Factor Module will be presented by TE optic development engineers during the VCSEL Interconnects technical session on Wednesday, March 20, 2013, at 8 a.m. in room 303B, session OW1B.1.
ABOUT TE CONNECTIVITY
TE Connectivity (NYSE: TEL) is a $13 billion world leader in connectivity. The company designs and manufactures products at the heart of electronic connections for the world’s leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity’s long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in over 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day. To connect with the company, visit: http://www.TE.com.