19 March 2015
PETRA (Photonics Electronics Technology Research Association)
Sumitomo Edogawabashi Ekimae Build. 7th Floor
20-10 Sekiguchi 1-chome, Bunkyo-ku, Tokyo 112-0014 JAPAN
Tel: +81-3-6265-0056, FAX: +81-3-5225-6435
PETRA demonstrates Low Power Silicon Photonics I/O Core and 25Gbps transmission over 300m MMF.
Live Technology Demonstration and Technical Presentation at OFC 2015
Tokyo, Japan. – March 19, 2015
Photonics Electronics Technology Research Association (PETRA), an association of Japanese companies and research laboratories, today announced that at OFC 2015 it will show live demonstration of 100Gbps transmission over 300m MMF using its innovative silicon photonics I/O core. The novel I/O core comprises transceivers in 5mm x 5mm chip scale package with ultra-low 5 mW/Gbps power dissipation. The demonstration will show live transmission in O-band using 4x25Gbps transceivers, which can be extended to 12 or higher number of channels to achieve throughput greater than 300Gbps (Booth No. 2230).
"This technology demonstration opens the door for applications such as high speed multi-lane 100Gbps and higher rate datacom links, and active optical interconnects with high energy efficiency", said Mr. Kazuhiko Kurata, Chief Engineering Director of PETRA. "This is a milestone result enabling real application of Silicon photonics I/O core in datacenter links and chip-to-chip communication in servers", he added.
Optical interconnects are expected to penetrate shorter reach chip-to-chip and intra-chip (on-chip) links as the industry moves to higher data rates. This will especially be critical for system-in-package (SIP) architecture in which a number of integrated circuit chips are enclosed in a single package, reducing the development period and cost. Silicon photonic devices having benefits of economies of scale are suitable for large volume applications at very low cost.
Dr. Takahiro Nakamura, Chief Technology Director of PETRA commented, "The current work demonstrates a novel packaging concept for silicon photonic components along with electronics in a compact package with ultra-low power dissipation. The photonic integration platform consists of low voltage drive modulator, high sensitivity planer PIN photo diode, and laser diode mounted with passive alignment. These are packaged with low power CMOS driver and receiver ICs in high density optical coupling Pin structure".
"This is a very exciting development bringing us closer to the dream of realizing an on-chip server, a miniature server-board in a single chip." said Dr. Tomoyuki Fujita, Executive Director of PETRA. "High data rate optical engine with compact size and low power consumption is a key building block with unlimited applications in fields such as Datacom, Industrial, Medical and Consumer Electronics, and I look forward to having a handheld high performance computer (HPC) in the near future", he added.
Besides the live demonstration linking PETRA booth to Corning booth with ClearCurve LX MMF, PETRA will also present a technical paper Th1G.1 entitled "5 mW/Gbps hybrid-integrated Si-
photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF" on March 26th at the OFC 2015 Session: "Optical Transceiver Technologies for Datacom".
Photonics Electronics Technology Research Association (PETRA) is an incorporated technology research association under the Japanese Act on Research and Development Partnership concerning Mining and Manufacturing Technology, established on August 24, 2009. The organization, comprises 11 companies, AIST and OITDA together with academia including overseas Universities, carries out joint research on silicon photonics. PETRA is funded by several Japanese national R&D projects on leading-edge "Photonics and Electronics Converged Devices and Systems" in the field of information and communication technology.