• Technical Conference:  30 March – 03 April 2025
  • Exhibition: 01 – 03 April 2025
  • Moscone Center, San Francisco, California, USA

Kaiam Demonstrates 40gb/S Transmitter and Receiver Optical Subassemblies For Lr4 Applications at OFC

Exhibitor News

PRESS RELEASE

03 March 2011

Contact:
Dr. Jeff Crerie Kaiam Corporation Mobile: (323) 397-5511 Email: jeff@kaiamcorp.com

Kaiam Demonstrates 40gb/S Transmitter and Receiver Optical Subassemblies For Lr4 Applications at OFC/NFOEC 2011

Enables high performance, compact QSFP modules for telecom and datacom using Opnext 1310nm lasers

NEWARK, CA – March 3, 2011 – Kaiam Corporation, an emerging startup with a breakthrough optical integration technology will have a live demonstration of their QSFP transmitter and receiver optical subassemblies for 40GBASE-LR4 applications at OFC/NFOEC 2011 in Los Angeles. The 4 x 10Gb/s TOSA and ROSA deliver and receive a cumulative 40Gb/s in single mode fiber with a 10km reach. The subassemblies are used in QSFP modules for client side of telecommunications equipment and for high bandwidth switches and routers in enterprise networks and datacenters. The Kaiam hybrid integration technology is able to achieve the very high densities needed for such compact transceivers.

As bandwidth needs increase, the requirements for high density and low power consumption become increasingly important, and some form of optical integration is necessary. Monolithic approaches are generally costly to develop, consume expensive semiconductor real estate, and compromises are made on the performance of the integrated elements. Purely hybrid packages suffer from the tight alignment requirements of single mode optics and relatively poor coupling efficiency between elements. Kaiam uses silicon micromechanics to solve the alignment issues and build photonic integrated circuits (PICs) for any application. The single use micromechanics aligns the optical beams only during assembly and is then permanently locked down. Thus there is no need for control of the coupling during operation. These micromechanically aligned PICs are inexpensive to develop and deliver very high yield in manufacturing since individual elements can be tested prior to assembly. Furthermore, the best technology can be used for each element of the PIC.

John Heanue, Kaiam’s Vice President of Technology Development commented, “The availability of high performance uncooled 1310nm lasers from Opnext has allowed us to develop a QSFP package with wide open RF characteristics and superb high temperature performance. Together with the coupling efficiencies that we obtain with our alignment process, the overall performance is very difficult to match with conventional integrated array or purely hybrid technologies.”

"Opnext continues to drive industry technologies," said Josef Berger, Director of Product Marketing at Opnext. "We have chosen to work with Kaiam because their innovative packaging approach is a natural complement to our industry leading laser technology.”

The company will be demonstrating the performance of their QSFP TOSA and ROSAs at the Optical Fiber Communication Conference and Exposition/National Fiber Optic Engineers Conference (OFC/NFOEC) in Los Angeles (March 8 - 10) in booth 718.

About Kaiam Corporation
Headquartered in Newark, California, Kaiam Corporation is a private company commercializing photonic integrated circuits for various applications. Founded by leading technologists from the optical networking industry, the team has a record of delivering breakthrough products that change the rules of the marketplace. It is currently working with multiple partners to deliver PIC-based products for various fiber optic applications. For more information, visit www.kaiamcorp.com.

About Opnext, Inc.
Opnext (NASDAQ:OPXT) is the optical technology partner of choice supplying systems providers and OEMs worldwidewith one of the industry's largest portfolio of 10G and higher next generation optical products and solutions. The Company's industry expertise, future-focused thinking and commitment to research and development combine in bringing to market the most advanced technology to the communications, defense, security and biomedical industries. Formed out of Hitachi, Opnext has built on more than 30 years experience in advanced technology to establish its broad portfolio of solutions and solid reputation for excellence in service and delivering value to its customers. For additional information, visit www.opnext.com.

Company Title Date