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CDFP MSA Releases Rev. 3.0 Specifications for 400 Gbps Interoperable Hot Pluggable Modules

New Style 3 module intended for applications based on proposed draft specifications from the IEEE P802.3bs 400 Gbps Ethernet task force– visit www.CDFP-MSA.com

Los Angeles, CA – March 24, 2015 - The CDFP Multi-Source Agreement (MSA) is pleased
to announce the release of Rev. 3.0 of the 400 Gbps (16 x 25 Gbps) pluggable transceiver specification at the Optical Fiber Communications (OFC) Exposition to be held March 22-26, 2015, at the Los Angeles Convention Center. This release includes a new Style 3 module intended for applications based on proposed draft specifications from the IEEE P802.3bs 400 Gbps Ethernet task force. The compliant Style 3 module uses the same connectors as Style 1 and Style 2 modules, but the Style 3 module cage is mechanically keyed to prevent mismating with Style 1 and Style 2 modules.
 
Designed for resource intensive applications in telecommunications, networking and enterprise computing environments, the CDFP interface enables data rates of 25 Gbps over 16 lanes for an aggregate of 400 Gbps on a single module with excellent signal integrity, thermal cooling properties, and EMI protection.
 
CDFP MSA founder-promoters include: Avago Technologies, Brocade Communications, IBM Corporation, JDS Uniphase, Juniper Networks, Molex Incorporated, and TE Connectivity.
Contributing member companies include: FCI, Finisar, Huawei, Inphi, Ixia, Mellanox Technologies, Nextron, Oclaro, Semtech, Sumitomo Electric, Xilinx, and Yamaichi Electronics. The CDFP MSA was founded in 2013 with the objective of defining specifications and promoting industry adoption.
 
Providing a high level of integration, performance and long-term reliability, the CDFP 400 Gbps interface is available in short- and long-body versions.  The specifications are compatible for use with direct attach cables, active optical cables, and connectorized optical modules.  
Designed for client-side interfaces inside the data center, CDFP modules enable high port density. The compact modules are well suited for low power applications using copper, VCSEL or silicon photonics based technology.  The CDFP modules are expected to find use in industry standards targeting 100 meters of MMF and up to 2 kilometers of SMF.  For example, the CDFP module can be used for one 400 Gbps interface or to aggregate sixteen 25 Gbps interfaces or to aggregate four 100 Gbps interfaces.
 
Complete specifications for the CDFP 3.0 interoperable hot pluggable modules and a complimentary white paper titled CDFP Delivers 400 Gbps Today are available on the 
CDFP MSA homepage.
 
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