Tuesday, 21 March 2016 10:15 – 10:45
DWDM to the Edge
Dr. Sean Long, Director, PLM for Transmission Network, Huawei USA
Bandwidth and latency are become critical factors for the new digital services. DWDM to the edge is the best solution to address this concern. The key challenges here are cost and flexibility. Huawei believe DWDM to OLT/Cloud BBU site is a MUST for a future proof network. This presentation introduce our revolutionary solution and latest applications such as CRAN.
Wednesday, 22 March 2016 10:15 – 10:45
Innovative OTN Cluster Solution for Cloud Era Transport Networks
Nagaraja Upadhya, Vice President, Fixed Network Product & Solutions,
Huawei Technologies USA, USA
Massive enterprise Cloud applications, VR/AR, Real time Video are driving need for huge capacity, lower latency, flexibility and agility in networks. As global industry leader, Huawei’s Optical innovation Engine continues to drive new solutions such as OTN Cluster that bring huge capacity, smooth scalability, seamless flexibility, cloud era Agility and dynamic capabilities to the transport network.
Wednesday, 22 March 2016, 11:00–11:30
Industries Standard for Pic’s design
Mitch Heins, North America Business Development, PhoeniX Software, The Netherlands
The push for greater bandwidth density communications is driving the Industry to integrated solutions using PIC’s. PhoeniX Software provides software / services that enable the creation and verification of such complex systems. Learn about the state-of-the-art in design flows and methodologies for integrated photonic and advanced photonic synthesis.
Wednesday, 22 March 2016, 11:30–12:00
Challenges in Optoelectronic Integration for Datacom Applications
Larry Tarof, Chief Photonics Scientist, Jabil AOC Technologies, USA
Significant challenges remain in realizing the zettabyte world, which, although market driven, is achievable only through lower cost and greater density. Successful integration paradigms, which must take into account choice of optoelectronic/electronic components, thermal/RF/alignment/coupling at the packaging level, and end-to-end testing solutions, are explored.
Wednesday, 22 March 2016, 13:30–14:00
400GE from Hype to Reality
Mark Gustlin, Principal System Architect, Xilinx, Inc., USA
400GE is the new Ethernet speed on the block set to finally become a reality in 2017 after much hype, discussion and standardization effort. This presentation will explore the realities of the 400GE ecosystems, deployment models and why the time for 400GE has arrived.
Wednesday, 22 March 2016, 14:00–14:30
400G P4 Programmable Packet Processing for NFV/SDN
Harpinder Matharu, Director of Communications Strategic & Technical Marketing, Xilinx Inc., USA
esentation discusses the adoption of P4, the emergent high-level language for packet processing, and will also discuss a record breaking 400 Gb/s line rate implementation built on two programmable technologies – a Xilinx FPGA and a MoSys programmable search engine.
Wednesday, 23 March 2016, 14:30–15:00
Yigal Ezra, CEO, ColorChip, Israel
Thursday 23 March 2016, 10:15–10:45
Huawei T-SDN OVPN Solution
Dr. Young Lee, Technical Director, Network Architecture of SDN, Huawei USA
Massive enterprise Cloud applications, VR/AR, real time video are driving need for huge bandwidth, lower latency, flexibility and agility in networks. Huawei’s Optical innovation Engine drives new innovative solutions that address these needs & challenges. This presentation introduces our OTN Cluster & OXC 2.0 that flatten network architecture, bring smooth scalability, and improve flexibility of service while reducing latency.