Tuesday, 21 March–Thursday, 23 March
Expo Theater III, South Exhibit Hall K
Exhibitors highlight their newest developments, products and services in 30-minute presentations on the show floor.
Tuesday, 21 March 2017, 10:15 – 10:45
DWDM to the Edge
Dr. Sean Long, Director, PLM for Transmission Network, Huawei USA
Bandwidth and latency are become critical factors for the new digital services. DWDM to the edge is the best solution to address this concern. The key challenges here are cost and flexibility. Huawei believe DWDM to OLT/Cloud BBU site is a MUST for a future proof network. This presentation introduce our revolutionary solution and latest applications such as CRAN.
Wednesday, 22 March 2017, 10:15 – 10:45
Innovative OTN Cluster Solution for Cloud Era Transport Networks
Nagaraja Upadhya, Vice President, Fixed Network Product & Solutions,
Huawei Technologies USA, USA
Massive enterprise Cloud applications, VR/AR, Real time Video are driving need for huge capacity, lower latency, flexibility and agility in networks. As global industry leader, Huawei’s Optical innovation Engine continues to drive new solutions such as OTN Cluster that bring huge capacity, smooth scalability, seamless flexibility, cloud era Agility and dynamic capabilities to the transport network.
Wednesday, 22 March 2017, 11:00–11:30
Enhancing Photonic Integrated Circuits with Hybrid SOI & III-V Integration – PhoeniX Software PDK Available
Professor John Bowers, UCSB
During this presentation, John Bowers will be highlighting his heterogeneous integration on silicon with a number of PDK building blocks for hybrid SOI and III-V photonic integration.
Professor Bowers will also discuss collaboration with PhoeniX Software to enable Hybrid Platform PIC design through PDK integration with PhoeniX Software tools.”
Wednesday, 22 March 2017, 11:30–12:00
Challenges in Optoelectronic Integration for Datacom Applications
Larry Tarof, Chief Photonics Scientist, Jabil AOC Technologies, USA
Significant challenges remain in realizing the zettabyte world, which, although market driven, is achievable only through lower cost and greater density. Successful integration paradigms, which must take into account choice of optoelectronic/electronic components, thermal/RF/alignment/coupling at the packaging level, and end-to-end testing solutions, are explored.
Wednesday, 22 March 2017, 13:00–13:30
Industry’s Only All-in-One Spectral & Transport 100G Testing Solution
Jean-Sebastien Tassé and Jean-Marie Vilain, Product Line Managers, EXFO, Canada
This product showcase will reveal the industry’s only and all-in-one 100G commissioning, turn-up and troubleshooting testing solution on a single, versatile platform. EXFO’s new FTB-4 Pro platform 4-slot format enables true test orchestration through the unique combination of the FTBx-88200NGE 100G Multiservice tester with iOptics transceiver validation and the Optical Spectrum Analyzer - without the need to swap modules.
Wednesday, 22 March 2017, 13:30–14:00
400GE from Hype to Reality
Mark Gustlin, Principal System Architect, Xilinx, Inc., USA
400GE is the new Ethernet speed on the block set to finally become a reality in 2017 after much hype, discussion and standardization effort. This presentation will explore the realities of the 400GE ecosystems, deployment models and why the time for 400GE has arrived.
Wednesday, 22 March 2017, 14:00–14:30
P4 Programmable Packet Processing for NFV/SDN
Gordon Brebner, Distinguished Engineer, Xilinx
with Ed Doe, Barefoot, Michael Miller, MoSys, and Denis Matousek, Netcope
This panel session discusses the adoption of P4, the emergent high-level language for packet processing, and early implementations of P4 for FPGA and ASIC targets.
Wednesday, 23 March 2017, 14:30–15:00
Emerging Integrated Optics Based Solutions for Data Center Interconnect
Yigal Ezra, CEO, ColorChip, Israel
ColorChip's unique approach to addressing datacenter requirement for increasing throughput, embraces a multilane Photonic Integrated Circuit, compatible with compact form factors.
This is a groundbreaking integration and packaging technique, used in ColorChip's 100G QSFP28 Single Mode solutions and will be used in ColorChip's 400G roadmap, resulting in cost-effective, compact hyper-scale single-mode, pluggable transceivers and On Board Optics (OBO).
Wednesday, 23 March 2017, 15:00–15:30
Optimizing TDECQ Stability in 28GBd and 56GBd PAM4 Optical Measurements
Pavel Zivny, Domain Expert – High Speed Serial, Tektronix, Inc., USA
PAM4 optical standards require new test methodology. The most complicated and most demanding measurement for optical PAM4 is the TDECQ measurement. We will discuss the implications of equalization, optimization, and measurement bandwidth on the TDECQ result.
Thursday 23 March 2017, 10:15–10:45
Huawei T-SDN OVPN Solution
Dr. Young Lee, Technical Director, Network Architecture of SDN, Huawei USA
Massive enterprise Cloud applications, VR/AR, real time video are driving need for huge bandwidth, lower latency, flexibility and agility in networks. Huawei’s Optical innovation Engine drives new innovative solutions that address these needs & challenges. This presentation introduces our OTN Cluster & OXC 2.0 that flatten network architecture, bring smooth scalability, and improve flexibility of service while reducing latency.