The Optical Networking and Communication
Conference & Exhibition

Los Angeles Convention Center,
Los Angeles, California, USA

Tuesday, 21 March 2017, 10:15 – 10:45
DWDM to the Edge

Dr. Sean Long, Director, PLM for Transmission Network, Huawei USA 
Bandwidth and latency are become critical factors for the new digital services. DWDM to the edge is the best solution to address this concern. The key challenges here are cost and flexibility. Huawei believe DWDM to OLT/Cloud BBU site is a MUST for a future proof network. This presentation introduce our revolutionary solution and latest applications such as CRAN.

Wednesday, 22 March 2017, 10:15 – 10:45

Innovative OTN Cluster Solution for Cloud Era Transport Networks

Nagaraja Upadhya, Vice President, Fixed Network Product & Solutions,
Huawei Technologies USA, USA

Massive enterprise Cloud applications, VR/AR, Real time Video are driving need for huge capacity, lower latency, flexibility and agility in networks. As global industry leader, Huawei’s Optical innovation Engine continues to drive new solutions such as OTN Cluster that bring huge capacity, smooth scalability, seamless flexibility, cloud era Agility and dynamic capabilities to the transport network.

Wednesday, 22 March 2017, 11:00–11:30

Industries Standard for Pic’s design

Mitch Heins, North America Business Development, PhoeniX Software, The Netherlands 

The push for greater bandwidth density communications is driving the Industry to integrated solutions using PIC’s. PhoeniX Software provides software / services that enable the creation and verification of such complex systems. Learn about the state-of-the-art in design flows and methodologies for integrated photonic and advanced photonic synthesis.

Wednesday, 22 March 2017, 11:30–12:00

Challenges in Optoelectronic Integration for Datacom Applications

Larry Tarof, Chief Photonics Scientist, Jabil AOC Technologies, USA  
Significant challenges remain in realizing the zettabyte world, which, although market driven, is achievable only through lower cost and greater density.  Successful integration paradigms, which must take into account choice of optoelectronic/electronic components, thermal/RF/alignment/coupling at the packaging level, and end-to-end testing solutions, are explored.

Wednesday, 22 March 2017, 13:30–14:00

400GE from Hype to Reality
Mark Gustlin, Principal System Architect, Xilinx, Inc., USA 

400GE is the new Ethernet speed on the block set to finally become a reality in 2017 after much hype, discussion and standardization effort. This presentation will explore the realities of the 400GE ecosystems, deployment models and why the time for 400GE has arrived.

Wednesday, 22 March 2017, 14:00–14:30
400G P4 Programmable Packet Processing for NFV/SDN

Harpinder Matharu, Director of Communications Strategic & Technical Marketing,
Xilinx Inc., USA 
This presentation discusses the adoption of P4, the emergent high-level language for packet processing, and will also discuss a record breaking 400 Gb/s line rate implementation built on two programmable technologies – a Xilinx FPGA and a MoSys programmable search engine.

Wednesday, 23 March 2017, 14:30–15:00

Emerging Integrated Optics Based Solutions for Data Center Interconnect

Yigal Ezra, CEO, ColorChip, Israel 

ColorChip's unique approach to addressing datacenter requirement for increasing throughput, embraces a multilane Photonic Integrated Circuit, compatible with compact form factors.

This is a groundbreaking integration and packaging technique, used in ColorChip's 100G QSFP28 Single Mode solutions and will be used in ColorChip's 400G roadmap, resulting in cost-effective, compact hyper-scale single-mode, pluggable transceivers and On Board Optics (OBO).

Thursday 23 March 2017, 10:15–10:45

Huawei T-SDN OVPN Solution

Dr. Young Lee, Technical Director, Network Architecture of SDN, Huawei USA 

Massive enterprise Cloud applications, VR/AR, real time video are driving need for huge bandwidth, lower latency, flexibility and agility in networks. Huawei’s Optical innovation Engine drives new innovative solutions that address these needs & challenges. This presentation introduces our OTN Cluster & OXC 2.0 that flatten network architecture, bring smooth scalability, and improve flexibility of service while reducing latency.

Sponsored by: