Tuesday, 21 March 2017; 16:00 - 17:00
Expo Theater III
Session organized by IPSR and OIDA
This session will be presentations by representatives of the coordinated institutions and manufacturing firms who are roadmapping integrated photonic systems. The Chair of the session will be Dr. Robert C. Pfahl, Roadmapping Director of the Integrated Photonic Systems Roadmap (IPSR). Participating organizations will include IPSR, the Heterogeneous Integration Roadmap (HIR), the Tyndall Institute, OIDA, and Molex. The emphasis of the presentations will be critical technology needs to develop a high-volume, low-cost integrated photonics supply chain that will meet the commercial needs of emerging applications.
, Roadmapping Director, IPSR, USA
Robert C. Pfahl
, Roadmapping Director, IPSR, USA
Dr. Pfahl is the Roadmapping Director for the Integrated Photonic System Roadmap (IPSR) which is funded by AIM Photonics. He is responsible for leading the development of the PSMC Roadmap, including developing the gap analysis, the product emulators, and identifying possible projects for technology development by AIM Photonics and the industrial supply chain. Dr. Pfahl also is currently Senior Consultant for the International Electronics Manufacturing Initiative (iNEMI). He previously served as Vice President of Global Operations for iNEMI and has been actively involved with the consortium since its beginning in 1994. He created the iNEMI roadmapping process and led that organization’s global efforts to reduce the environmental impact of electronic products. Prior to joining iNEMI, Dr. Pfahl was Director of International and Environmental Research and Development at Motorola Labs, where he established and led Motorola’s Environmental Technology R&D and Advanced Manufacturing Technology R&D labs in China, Brazil and Germany. He also worked at Bell Labs/Western Electric in a number of research, manufacturing, and management positions related to electronics and semiconductor manufacturing. The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) presented Dr. Pfahl with its 2005 Electronics Manufacturing Technology Award. He was lauded for developing new manufacturing processes, reducing the environmental impact of electronic manufacturing processes and fostering collaboration within the manufacturing technology community.
, Co-Chair, Heterogeneous Integration Roadmap (HIR), USA
Dr. Bottoms is Co-Chair of the Heterogeneous Integration Roadmap (HIR) and also the Chair of the IPSR Electronic-Photonic Packaging Technology Working Group (TWG). Currently Chairman of Third Millennium Test Solutions (3MTS), he has participated in the start-up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies both directly and indirectly related to semiconductor, including: Microelectronics Packaging Inc., Credence Systems, Third Millennium Test Solutions (3MTS), Tessera, SBA Materials, and APMT.
, Tyndall Institute, Ireland
Dr. Peter O’Brien obtained his PhD in Physics from University College Cork in 1999. He has a Masters in Electronic Engineering and Degree in Physics from Trinity College Dublin. He was a postdoctoral scholar at the California Institute of Technology and research scientist at NASA’s Jet Propulsion Laboratory in Pasadena (Micro Devices Laboratory) where he worked on the development of millimetre wave devices for remote sensing applications. Dr O’Brien co-founded one (Biosensia) and founded a second company (Epi-Light). His second company, Epi-Light limited, developed speciality photonic systems for medical device and pharmaceutical applications. He successfully sold the company in 2009 and returned to the Tyndall National Institute to establish a research activity in advanced photonic packaging. Dr O’Brien is now head of the Photonics Packaging Group and is involved in a wide range of both academic and industry research projects, across the telecoms and medical device sectors. Dr. O’Brien is also deputy director of the Science Foundation Ireland, Irish Photonic Integration Centre.
, Director of Advanced Interconnect Technology, Molex, USA
Tom Marrapode is Director of Advanced Interconnect Technology Development for Molex's Optical Solutions Group, where he has worked the past 20 years. He has over 30 years’ experience in the field of fiber optics including sales, marketing, design and manufacturing of optical interconnects and optical backplane technology. Prior to joining Molex, Tom held positions with Anixter, Amphenol Fiber Optics and Rockwell Telecommunications. He is co-inventor on 22 Patents, an invited speaker at IEEE, OIDA, ICSJ, JIEP conferences and has many technical articles and papers published in the field of fiber optics interconnect technology.
, Senior Advisor, OSA-OIDA, USA
With over 35 years in optoelectronics, Dr. Hausken focuses on industry activities at OSA—the Optical Society. This includes OIDA (OSA Industry Development Associates, now a trade association activity within OSA), where he held a position earlier in his career. For 13 years until 2012, Dr. Hausken led market research and strategy consulting for lasers, image sensors, and a range of other photonic products at Strategies Unlimited. He was also a telecom policy analyst at the U.S. Congressional Office of Technology Assessment, and held R&D and production positions at Alcatel and Texas Instruments in photonics and electronics. He has a PhD from the University of California at Santa Barbara, in optoelectronics.