Tuesday, 21 March, 13:45 - 14:45
Expo Theater III
Session Organized by OIF
The OIF continues to enable next generation solutions for today’s networking, compute and telecom markets. This session will cover the operating, live, interoperability demonstrations that OIF members are displaying in booth #3853 including serial 50Gbps electrical links, pluggable coherent optics, and Flex Ethernet (FlexE). The panelists will discuss the OIF Implementation Agreement development work that has led to these demos and provide an update on the current status. In addition, some of the OIF’s new, future work in process will be discussed.
, OIF Physical and Link Layer Interoperability Working Group Chair, Keysight Technologies, USA
, OIF Technical Committee Vice Chair, Semtech, USA
Ed Frlan is a Senior System Architect within the Gennum Products Group of Semtech Corp responsible for the definition of next generation physical layer products. He is presently OIF’s Technical Committee Vice Chair and is active in the development of the new PAM4 based electrical interface specifications. He joined Gennum from a Hardware Architect position within the Metro Ethernet Networks division of Ciena where he was responsible for the system architecture and synchronization aspects of various line cards (including Carrier Ethernet, SONET, OTN and Broadcast Video). Ed holds a Ph.D. degree in Electrical Engineering from Carleton University.
, OIF Physical and Link Layer Working Group - Optical Vice Chair, USA
, Network Architect, Google, USA
Tad Hofmeister has been a Network Architect at Google since 2011, with a focus in metro and long-haul DWDM networking. Prior to Google, Tad was an architect, system engineer, and hardware designer for several optical transport and packet processing companies including: Ciena, Matisse Networks, OpVista, and Applied Signal Technology. Dr. Hofmeister earned MS and Ph.D. degrees in EE from Stanford University and BS degrees from Columbia University and Bates College.