The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Enabling Next Generation Physical Layer Solutions

Tuesday, 21 March, 13:45 - 14:45
Expo Theater III

Session Organized by OIF
OIF

 

Session Description

The OIF continues to enable next generation solutions for today’s networking, compute and telecom markets.  This session will cover the operating, live, interoperability demonstrations that OIF members are displaying in booth #3853 including serial 50Gbps electrical links, pluggable coherent optics, and Flex Ethernet (FlexE).  The panelists will discuss the OIF Implementation Agreement development work that has led to these demos and provide an update on the current status.  In addition, some of the OIF’s new, future work in process will be discussed.
 

Moderator

Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair, Keysight Technologies, USA
 

Presenters

Ed Frlan, OIF Technical Committee Vice Chair, Semtech, USA

Ed Frlan is a Senior System Architect within the Gennum Products Group of Semtech Corp responsible for the definition of next generation physical layer products. He is presently OIF’s Technical Committee Vice Chair and is active in the development of the new PAM4 based electrical interface specifications. He joined Gennum from a Hardware Architect position within the Metro Ethernet Networks division of Ciena where he was responsible for the system architecture and synchronization aspects of various line cards (including Carrier Ethernet, SONET, OTN and Broadcast Video). Ed holds a Ph.D. degree in Electrical Engineering from Carleton University.


Karl Gass, OIF Physical and Link Layer Working Group - Optical Vice Chair, USA


Tad Hofmeister, Network Architect, Google, USA

Tad Hofmeister has been a Network Architect at Google since 2011, with a focus in metro and long-haul DWDM networking. Prior to Google, Tad was an architect, system engineer, and hardware designer for several optical transport and packet processing companies including: Ciena, Matisse Networks, OpVista, and Applied Signal Technology. Dr. Hofmeister earned MS and Ph.D. degrees in EE from Stanford University and BS degrees from Columbia University and Bates College.

Sponsored by: