The Optical Networking and Communication
Conference & Exhibition

San Diego Convention Center,
San Diego, California, USA

Panel V: Photonic Integration Business Case – Reality Check

Thursday, 23 March
10:30 - 12:00
Theater I

Rick Dodd; SVP, Open Architecture, Ciena, USA

Panel Description:

Driven by 100Gbps in long haul as well as in data center applications, there is continued progress for companies to commercialize products based on integrated photonics on the InP, GaAs and Silicon platforms. InP and GaAs technologies have dominated the market over the last decade, and recently we have seen successes by vendors to ship integrated products using silicon photonics. This panel brings together experts from key players and continues to review the start of the art in photonic integration with a focus on deployment scenarios for both telecom and datacom. It aims to address the key questions as follows:

  • What are the key challenges to realize the high volume and low cost?

  • Which technologies offer the best approach to reduce the cost for manufacturability?

  • Will Silicon Photonics ever replace the more mature InP and GaAs technologies?

  • What are the lessons learned from the experience of deployment?

  • How does photonic integration address the emerging application needs?

  • Are there any new and noteworthy products being commercialized today?

  • What is the status of new developments and standardization of packaging solutions?

  • Where are the market opportunities for optical integration technologies?

  • How does the outlook or roadmap look like for next 5 years?


Rick Dodd; SVP, Open Architecture, Ciena, USA (Moderator)
Martin Guy; Sr. Director, Packet Optical Platforms, Ciena, Canada
Frederick Kish Jr.; Sr. VP of the Optical Integrated Circuit Group, Infinera Corporation, USA
Radha Nagarajan; CTO, Optical Interconnect, Inphi Corporation, USA
James Regan; CEO, EFFECT Photonics B.V., Netherlands
Tom Williams, Sr. Director of Marketing, Acacia Communications, USA



Rick Dodd; SVP, Open Architecture, Ciena, USA (Moderator)

Rick Dodd is currently SVP Open Architecture, and is focused on driving and evangelizing openness across Ciena’s product offerings.  Previously, Rick served as Ciena’s Senior Vice President, Marketing. Before rejoining Ciena in December 2010, Rick served as Vice President of Product Marketing for Infinera. Prior to Infinera, he was an Associate Partner at venture capital firm Kleiner, Perkins, Caufield and Byers, where he was focused on networking and semiconductor startups and played a key role in KPCB’s founding investment in Infinera.   Earlier, Rick joined Ciena through the acquisition of Lightera Networks, where he served as Director of Product Management for the CoreDirector switch. Rick holds a B.S. in Electrical Engineering from Brown University and a M.B.A. from Stanford Graduate School of Business.


InP and Silicon Photonics: What Will Survive the Future?

Martin Guy; Sr. Director, Packet Optical Platforms, Ciena, Canada

From 1996 to 2000, Mr. Guy worked at INO (Institut National d’Optique) as Head of Technology for the Optical Communications Group. In April 2000, he co-founded TeraXion and acted as the CTO and V-P Product Management of the company. He recently joined Ciena as Senior Director, Packet Optical Platforms following the acquisition of TeraXion’s photonic integration activities by Ciena. Mr. Guy holds a B.Eng., M.Sc. and Ph.D. degrees in Electrical Engineering from Université Laval in Québec City. He has worked in the field of photonics for more than 25 years and has over 100 publications in international journals and conferences.

Frederick Kish Jr.; Sr. VP of the Optical Integrated Circuit Group, Infinera Corporation, USA
Fred A. Kish, Jr. is Senior Vice President of the Optical Integrated Circuit Group at Infinera Corporation.  He received his Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign in 1992, respectively. His Ph.D. research work (under Nick Holonyak, Jr.) is part of the core Al-bearing III-V native-oxide technology that has enabled the development of the highest performance VCSELs and has been licensed to VCSEL manufacturers throughout the world.  From 1992 to 1999, he was at Hewlett-Packard’s Optoelectronics Division where he co-invented and led the commercialization of the highest performance (efficiency) red-orange-yellow visible LEDs produced at the time.  From 1999 to 2001, he was with Agilent Technologies Fiber Optics Components Division as the III-V Department Manager.  In 2001, he joined Infinera Corporation where he co-invented and led the effort to research, develop, and commercialize the first practical (commercially deployed) fully integrated system-on-a-chip for optical communications.  These multi-channel DWDM transmitter and receiver InP photonic integrated circuits (PICs) are at the core of Infinera’s optical network products and have been one of the key enabling technologies behind over $4B in PIC-based networking product sales.  Dr. Kish is a Fellow of the OSA and IEEE and a member of the National Academy of Engineering.  He has coauthored over 100 U.S. patents, over 150 peer-reviewed journal and conference publications, and 4 book chapters on optoelectronic devices and materials.

Switch Pluggable, DWDM Modules for 4Tbit/s, >80km Inter-Datacenter Links

Radha Nagarajan; CTO, Optical Interconnect, Inphi Corporation, USA

Radha Nagarajan has served as Inphi’s Chief Technology Officer, Optical Interconnect, since June 2013. He brings more than 20 years of experience in the area of high-speed optical interconnects. Prior to joining Inphi, he was with Infinera, as a Fellow, working on the design, development and commercialization of large-scale photonic integrated circuits. From 1995 until 2001, he was with SDL (acquired by JDS Uniphase), where his last assignment was to manage the development of a new generation of 980nm EDFA pump module.  Dr. Nagarajan is a Fellow of the IEEE, the OSA and the IET. He has authored four book chapters in the areas of high-speed optical components and photonic integration. In 2006, he shared the IEEE/LEOS Aron Kressel Award for his work on commercializing large-scale photonic integrated circuits. He has been awarded 92 US patents. He received his B.Eng. degree in Electrical Engineering from the National University of Singapore. He obtained his M.Eng. degree in Electronic Engineering from the University of Tokyo, and Ph.D. in Electrical and Computer Engineering from the University of California, Santa Barbara.

The Route to Cost Effective Products Using Photonic Integration and Novel Packaging

James Regan; CEO, EFFECT Photonics B.V., Netherlands

James Regan joined start-up EFFECT Photonics in 2011.  He has spent thirty years building optical communications component businesses including strategic roles at Nortel Networks, Agility and JDSU.  His industry experience, market knowledge, business acumen and passion for cutting edge technology are the drivers for taking up the CEO role at EFFECT.

Tom Williams, Sr. Director of Marketing, Acacia Communications, USA

Tom Williams is Sr. Director of Marketing at Acacia Communications.  Before joining Acacia, Tom spent 14 years at Finisar (initially Optium) Corporation, where he was Director of PLM for coherent and direct detect transport products above 100Gbps.  Tom has also held positions at Lucent Technologies and Northrop Grumman Corporation.  He has an MS in Electrical Engineering from Johns Hopkins University and BS degrees in Electrical Engineering and Physics from Widener University.




Sponsored by: