The Optical Networking and Communication
Conference & Exhibition

Los Angeles Convention Center,
Los Angeles, California, USA

Panel V: Photonic Integration Business Case – Reality Check

Panel V: Photonic Integration Business Case – Reality Check

Thursday, 23 March
10:30 - 12:00

Rick Dodd; Ciena, USA 

Panel Description:

Driven by 100Gbps in long haul as well as in data center applications, there is continued progress for companies to commercialize products based on integrated photonics on the InP, GaAs and Silicon platforms. InP and GaAs technologies have dominated the market over the last decade, and recently we have seen successes by vendors to ship integrated products using silicon photonics. This panel brings together experts from key players and continues to review the start of the art in photonic integration with a focus on deployment scenarios for both telecom and datacom. It aims to address the key questions as follows:

  • What are the key challenges to realize the high volume and low cost?

  • Which technologies offer the best approach to reduce the cost for manufacturability?

  • Will Silicon Photonics ever replace the more mature InP and GaAs technologies?

  • What are the lessons learned from the experience of deployment?

  • How does photonic integration address the emerging application needs?

  • Are there any new and noteworthy products being commercialized today?

  • What is the status of new developments and standardization of packaging solutions?

  • Where are the market opportunities for optical integration technologies?

  • How does the outlook or roadmap look like for next 5 years?


James Regan; CEO, EFFECT Photonics B.V., Netherlands
Martin Guy; Ciena, Canada
Radha Nagarajan; CTO Optics, Inphi Corporation, USA
Tom Williams, Acacia Communications, USA
Frederick Kish Jr.; Sr. VP Optical Integrated Components Group, Infinera Corporation, USA



Rick Dodd; Ciena, USA 
Rick Dodd is currently SVP Open Architecture, and is focused on driving and evangelizing openness across Ciena’s product offerings.  Previously, Rick served as Ciena’s Senior Vice President, Marketing. Before rejoining Ciena in December 2010, Rick served as Vice President of Product Marketing for Infinera. Prior to Infinera, he was an Associate Partner at venture capital firm Kleiner, Perkins, Caufield and Byers, where he was focused on networking and semiconductor startups and played a key role in KPCB’s founding investment in Infinera.   Earlier, Rick joined Ciena through the acquisition of Lightera Networks, where he served as Director of Product Management for the CoreDirector switch. Rick holds a B.S. in Electrical Engineering from Brown University and a M.B.A. from Stanford Graduate School of Business.


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